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Improvement of Thermoelectric Performance for Sb-Doped SnO2 Ceramics Material by Addition of Cu as Sintering Additive

机译:通过添加Cu作为烧结助剂提高掺Sb的SnO2陶瓷材料的热电性能

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摘要

The thermoelectric properties, such as the Seebeck coefficient value, S, electrical conductivity, sigma, and thermal conductivity, kappa, of Sb- and Cu-doped SnO2, that is, (Sn1-x-y Cu (x) Sb (y) )O-2, were investigated in detail. The addition of a small amount of CuO significantly improved the relative density of the SnO2 ceramics. However, the relative density slightly decreased with the excessive addition of CuO (more than x = 0.03). The addition of Sb2O5 should cause an increase in the number of charge carriers, resulting in an increased sigma value, and the addition of both CuO and Sb2O5 caused an increase in sigma and |S| at high temperature. The improvement of the sintering performance caused the enhancement of the thermoelectric performance. As the temperature region measured in this study (293-1073 K), the maximum ZT value was 0.29 at 1073 K for (Sn0.985Cu0.005Sb0.01)O-2.
机译:Sb和Cu掺杂的SnO2的塞贝克系数值S,电导率sigma和热导率kappa的热电特性,即(Sn1-xy Cu(x)Sb(y))O -2,进行了详细调查。少量CuO的添加显着提高了SnO2陶瓷的相对密度。但是,随着CuO的过量添加(大于x = 0.03),相对密度略有下降。 Sb2O5的添加应导致电荷载流子数量的增加,从而导致sigma值增加,而CuO和Sb2O5的添加均导致sigma和| S |的增加。在高温下。烧结性能的提高引起热电性能的提高。作为本研究中测得的温度区域(293-1073 K),对于(Sn0.985Cu0.005Sb0.01)O-2,在1073 K时最大ZT值为0.29。

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