首页> 外文期刊>Journal of Electroanalytical Chemistry: An International Journal Devoted to All Aspects of Electrode Kinetics, Interfacial Structure, Properties of Electrolytes, Colloid and Biological Electrochemistry >Electroreduction of cupric(II) ions at the ultramicroelectrodes from concentrated electrolytes - Comparison of industrial and laboratory prepared aqueous solutions of copper(II) ions in sulfuric acid electrolytes
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Electroreduction of cupric(II) ions at the ultramicroelectrodes from concentrated electrolytes - Comparison of industrial and laboratory prepared aqueous solutions of copper(II) ions in sulfuric acid electrolytes

机译:浓缩电解质在超微电极上电解还原铜离子-工业和实验室制备的硫酸电解质中铜离子的水溶液比较

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摘要

The electroreduction of cupric ions has always attracted considerable attention because of its importance for both fundamental and applied aspects. In this paper, the electrodeposition of copper from concen_trated real refinery and laboratory prepared electrolytes is investigated. The influence of the complex matrix present in industrial electrolytes (from which active animal glue and thiourea were removed) on the copper electrodeposition mechanism and kinetics was not sufficiently studied in the past. The same can be stated regarding the copper electroreduction investigations in concentrate electrolytes. The influence of potential and temperature on potentiostatic reduction of copper ions at gold ultramicro_electrodes in both electrolytes is studied by chronoamperometric methods. In both studied electrolytes the mechanism of copper nucleation was found to be diffusion controlled, 3D and progressive. The values of apparent bulk diffusion coefficients and the rates of copper nuclei formation in both industrial and syn_thetic electrolytes are estimated and compared. In both solutions the rate of nucleation increases with absolute value of potential and temperature. Increasing deposit potentials produces smaller nuclei and higher nuclei copper population density. In the whole studied temperatures and potentials ranges AN_χ changes from 3.30 x 10~9 to 2.50 x 10~13 cm~-2 s~-2 in industrial and from 1.77 x 10~10 to 1.49 x 10~13 cm~-2 s~-2 in laboratory prepared electrolytes. The values of diffusion coefficients obtained for industrial and for laboratory prepared solutions do not differ markedly.
机译:铜离子的电还原一直以来都吸引了相当多的关注,因为它对于基础和应用方面都很重要。本文研究了浓缩炼厂和实验室制备的电解液中铜的电沉积。过去,尚未充分研究工业电解质中存在的复杂基质(已去除了活性动物胶和硫脲)对铜电沉积机理和动力学的影响。关于浓缩电解质中的铜电解还原研究,可以说是相同的。通过计时电流法研究了电位和温度对两种电解液中金超微电极上铜离子恒电位还原的影响。在两种研究的电解质中,发现铜成核机理是扩散控制的,3D的和渐进的。估算并比较了表观体积扩散系数的值以及工业电解质和合成电解质中铜核的形成速率。在这两种解决方案中,成核速率随电势和温度的绝对值而增加。沉积电位的增加会产生较小的核和较高的核铜种群密度。在整个研究的温度和电势范围中,AN_χ在工业上从3.30 x 10〜9到2.50 x 10〜13 cm〜-2 s〜-2改变,从1.77 x 10〜10到1.49 x 10〜13 cm〜-2 s改变。在实验室准备的〜-2电解质。对于工业溶液和实验室制备的溶液,获得的扩散系数值没有显着差异。

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