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首页> 外文期刊>Journal of Colloid and Interface Science >Interfacial assembly of a phospholipid Langmuir monolayer by electrodeposited silver colloids
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Interfacial assembly of a phospholipid Langmuir monolayer by electrodeposited silver colloids

机译:电沉积银胶体对磷脂Langmuir单分子层的界面组装

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Two-dimensional nanostructured silver films were electrodeposited at the surface of a silver nitrate subphase coated by a negatively charged dimyristoylphosphatidylglycerol (DMPG) Langnmir monolayer. The modifications of the phospholipid inter-facial organization generated by the growing colloidal silver film were investigated using surface pressure-time isotherms and grazing incidence X-ray diffraction experiments (GIXD). A decrease in the initial surface pressure of the DMPG monolayer is observed outside of the growing silver film, followed by a stabilization of the surface pressure when the radius of the metallic layer reaches its plateau value. This behavior is attributed to the compression of the DMPG molecules above the silver film and to the correlated relaxation and expansion of those outside the silver film area as recorded by a Wilhelmy pressure sensor. GIXD experiments further evidenced the contraction of the phospholipid monolayer above the electrochemically growing films. Indeed, the diffraction spectra show a shift in the peak position toward higher values of the in-plane component of the wave-vector transfer, indicating a closer packing of the DMPG alkyl chains. This is also in agreement with the observed loss of the chain tilt angle, suggesting that the colloidal silver film induces interfacial structuring of the DMPG monolayer. (c) 2006 Elsevier Inc. All rights reserved.
机译:将二维纳米结构的银薄膜电沉积在硝酸银亚相的表面,该亚银表面带有带负电的二肉豆蔻酰基磷脂酰甘油(DMPG)Langnmir单层。使用表面压力-时间等温线和掠入射X射线衍射实验(GIXD)研究了由生长的胶态银膜产生的磷脂界面组织的修饰。在生长的银膜外观察到DMPG单层的初始表面压力降低,然后当金属层的半径达到其平稳值时,表面压力稳定。这种行为归因于在银膜上方的DMPG分子的压缩,以及归因于Wilhelmy压力传感器记录的那些在银膜区域之外的分子的相关弛豫和膨胀。 GIXD实验进一步证明了电化学生长薄膜上方磷脂单层的收缩。确实,衍射光谱显示出峰位置朝着波矢量转移的面内分量的较高值移动,表明DMPG烷基链的堆积更紧密。这也与观察到的链倾斜角的损失相一致,表明胶体银膜诱导了DMPG单层的界面结构。 (c)2006 Elsevier Inc.保留所有权利。

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