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首页> 外文期刊>Journal of Adhesion Science and Technology: The International Journal of Theoredtical and Basic Aspects of Adhesion Science and Its Applications in All Areas of Technology >Adhesion of copper to poly(tetrafluoroethylene-co-hexafluoropropylene)(FEP)surfaces modified by vacuum UV photo-oxidation downstream from Ar microwave plasma
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Adhesion of copper to poly(tetrafluoroethylene-co-hexafluoropropylene)(FEP)surfaces modified by vacuum UV photo-oxidation downstream from Ar microwave plasma

机译:铜对Ar微波等离子体下游的真空UV光氧化改性的聚四氟乙烯-共六氟丙烯(FEP)表面的附着力

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Poly(tetrafluoroethylene-co-hexafluoropropylene)(FEP)surfaces were exposed to vacuum UV(VUV)photo-oxidation downstream from Ar microwave plasma.The modified surfaces showed the following:(1)an improvement in wettability as observed by water contact angle measurements;(2)surface roughening;(3)defluorination of the surface;and(4)incorporation of oxygen as CF-O-CF_2,CF_2-O-CF_2 and CF-O-CF_3 moieties.With long treatment times,a cohesive failure of copper sputter-coated onto the modified surface occurred within the modified FEP and not at the Cu-FEP interface.
机译:聚(四氟乙烯-共六氟丙烯)(FEP)表面在Ar微波等离子体的下游受到真空UV(VUV)光氧化,改性后的表面显示以下内容:(1)通过水接触角测量观察到的可湿性有所改善;(2)表面粗糙化;(3)表面脱氟;以及(4)以CF-O-CF_2,CF_2-O-CF_2和CF-O-CF_3部分的形式引入氧。处理时间长,内聚破坏溅射镀覆在改性表面上的铜发生在改性FEP内,而不是在Cu-FEP界面处。

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