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Reliability analysis of bonded joints with variations in adhesive thickness

机译:粘合剂厚度变化的粘合接头的可靠性分析

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摘要

Bonded joints are used in several industrial applications as a surrogate of more expensive repairs, but their reliability must be ascertained. Failure in a bonded joint mainly occurs in the adhesive due to stress concentrations that directly depend on the adhesive thickness. In practice, it is difficult to ensure a good accuracy of the final adhesive thickness, leading to uncertainty to its spatial variability. This uncertainty greatly influences the strength of the bonded joint. This work deals with one of the main key issues in bonded joints: the influence of the spatial variations in the adhesive thickness on the reliability of the joint and an excessive shear stress level caused by the adhesive thickness variations may lead to failure. This paper provides reliability analysis by considering the adhesive thickness as a stochastic field. The experimental thickness field is obtained so as to identify the stochastic parameters. These parameters are then introduced in a structural reliability model to evaluate the failure probability. Results show the influence of adhesive thickness uncertainty on bonded joint failure.
机译:粘结接头在许多工业应用中被用作替代更昂贵的修理方法,但必须确定其可靠性。由于应力集中直接取决于粘接剂的厚度,粘接接头的失效主要发生在粘接剂中。实际上,难以确保最终粘合剂厚度的良好准确性,从而导致其空间可变性的不确定性。这种不确定性极大地影响了粘结接头的强度。这项工作涉及粘合接头中的主要关键问题之一:胶粘剂厚度的空间变化对接头可靠性的影响,以及由胶粘剂厚度变化引起的过大的剪切应力水平可能导致失效。本文通过将胶粘剂厚度视为随机场来提供可靠性分析。获得实验厚度场以识别随机参数。然后将这些参数引入结构可靠性模型中,以评估失效概率。结果表明,胶粘剂厚度不确定性对粘结接头失效的影响。

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