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Temperature Dependence of the Fracture Toughness of Adhesively Bonded Joints

机译:胶接接头断裂韧性的温度依赖性

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摘要

Adhesives used in structural high temperature space and aerospace applications must operate in extreme environments. They need to exhibit high-temperature capabilities in order to maintain their mechanical properties and their structural integrity at the intended service temperature. One class of the adhesives which are able to withstand the temperature extremes that are experienced in the space environment and are able to maintain a good degree of flexibility at very low temperatures are the room temperature vulcanizing (RTV) silicone adhesives. As is known, adhesive strength generally shows temperature dependence. Similarly, the fracture toughness is expected to show temperature dependence. In this study, the pure mode I fracture toughness for adhesive joints bonded with a high temperature RTV silicone adhesive was measured over a wide range of temperatures. Double cantilever beam (DCB) tests were performed on specimens at room temperature (RT), 100 and 200°C. Mode I traction-separation laws were obtained as a function of temperature, directly from the experiments, by differentiation of simultaneously measured data (the J-integral and the end-opening displacement). Results showed that the fracture toughness, the peak cohesive stress and the respective end-opening displacement all decreased with the temperature rise.
机译:结构高温空间和航空航天应用中使用的胶粘剂必须在极端环境下使用。它们需要表现出高温性能,以便在预期的使用温度下保持其机械性能和结构完整性。室温硫化(RTV)有机硅粘合剂是一类能够承受太空环境中遇到的极端温度并且能够在非常低的温度下保持良好的柔韧性的粘合剂。众所周知,粘合强度通常显示出温度依赖性。类似地,断裂韧性预期显示出温度依赖性。在这项研究中,在很宽的温度范围内测量了与高温RTV硅酮粘合剂粘合的粘合剂接头的纯I型断裂韧性。在室温(RT),100和200°C下对样品进行双悬臂梁(DCB)测试。通过同时测量的数据(J积分和端部开孔位移)的微分,直接从实验中获得了模式I牵引分离定律与温度的函数关系。结果表明,随着温度的升高,断裂韧性,峰值内聚应力和相应的开孔位移均降低。

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