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The Emptying Behavior of Highly Viscous Liquids. Part I: Polymeric Surfaces and Plasma Coatings

机译:高粘度液体的排空行为。第一部分:聚合物表面和等离子涂层

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摘要

Residues of fill goods on the inner side of packages are a problem not only from the economical point of view but also from an ecological perspective. For example, the cost of recycling increases with increasing amount of residues. Another point is the consumer satisfaction that declines when too much product remains in the package. The compositions of products as well as the packaging material have been optimized to provide specific characteristics, e.g., a particular taste or temperature resistance in case of viands, and, e.g., mechanical properties in case of packages. To achieve good anti-adhesive quality between such optimized systems one possible approach is to minimize adhesion forces between the inner side of the package and the fill good. This can be achieved by modifying the packages surfaces, e.g., by the use of plasma enhanced chemical vapor deposition (PECVD) with which deposition of defined nano-scale layers is possible. In this work plasma polymer coatings are compared with standard packaging material (PET) and typical anti-adhesive materials like PTFE with regard to emptying properties, surface free energy and work of adhesion. It will be shown that a low surface free energy is important for minimizing the residue. These low energetic surfaces can be designed by PECVD using two different chemical classes (PTFE- and silicone-analogous). The results show that besides surface free energy other physical-chemical characteristics of the packaged system influence the macroscopic amount of adhered fill goods.
机译:包装内部的填充物残留不仅是从经济角度考虑的问题,而且还从生态学角度来看是一个问题。例如,回收的成本随着残留物数量的增加而增加。另一点是,当包装中剩余太多产品时,消费者满意度会下降。产品和包装材料的组成已经过优化,以提供特定的特性,例如在使用蜂箱的情况下具有特定的味道或耐温性,以及在包装的情况下提供例如机械性能。为了在这种优化的系统之间获得良好的抗粘质量,一种可能的方法是最小化包装内侧和填充物之间的粘附力。这可以通过例如通过使用等离子增强化学气相沉积(PECVD)来改变包装表面来实现,该等离子体增强化学气相沉积(PECVD)可以沉积限定的纳米级层。在这项工作中,将等离子聚合物涂料与标准包装材料(PET)和典型的防粘材料(如PTFE)进行比较,以排空性能,表面自由能和粘附力。将显示出低的表面自由能对于使残留物最小化是重要的。可以通过PECVD使用两种不同的化学类别(类似PTFE和有机硅)设计这些低能表面。结果表明,除了表面自由能外,包装系统的其他物理化学特性还会影响附着物的宏观附着量。

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