首页> 外文期刊>Journal of Applied Mechanics: Transactions of the ASME >Spectral stiffness microplane model for quasibrittle composite laminates - Part II: Calibration and validation
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Spectral stiffness microplane model for quasibrittle composite laminates - Part II: Calibration and validation

机译:准脆性复合材料层压板的光谱刚度微平面模型-第二部分:校准和验证

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The spectral stiffness microplane (SSM) model developed in the preceding Part I of this study is verified by comparisons with experimental data for uniaxial and biaxial tests of unidirectional and multidirectional laminates. The model is calibrated by simulating the experimental data on failure stress envelopes analyzed in the recent so-called "World Wide Failure Exercise," in which various existing theories were compared. The present theory fits the experiments as well as the theories that were best in the exercise. In addition, it can simulate the post-peak softening behavior and fracture, which is important for evaluating the energy-dissipation capability of composite laminate structures. The post-peak softening behavior and fracture are simulated by means of the crack band approach which involves a material characteristic length.
机译:通过与单向和多向层压板的单轴和双轴试验的实验数据进行比较,验证了在本研究的第一部分中开发的光谱刚度微平面(SSM)模型。该模型是通过模拟在最近所谓的“全球失效演习”中分析的失效应力包络的实验数据进行校准的,该模型比较了各种现有理论。本理论适合于实验以及最适合该练习的理论。此外,它还可以模拟峰后的软化行为和断裂,这对于评估复合材料层合结构的能量耗散能力非常重要。峰值后的软化行为和断裂通过涉及材料特征长度的裂纹带方法进行模拟。

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