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How are hydrogen bonds modified by metal binding?

机译:金属键如何修饰氢键?

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摘要

We have used density functional theory calculations to investigate how the hydrogen-bond strength is modified when a ligand is bound to a metal using over 60 model systems involving six metals and eight ligands frequently encountered in metalloproteins. We study how the hydrogen-bond geometry and energy vary with the nature of metal, the oxidation state, the coordination number, the ligand involved in the hydrogen bond, other first-sphere ligands, and different hydrogen-bond probe molecules. The results show that, in general, the hydrogen-bond strength is increased for neutral ligands and decreased for negatively charged ligands. The size of the effect is mainly determined by the net charge of the metal complex, and all effects are typically decreased when the model is solvated. In water solution, the hydrogen-bond strength can increase by up to 37 kJ/mol for neutral ligands, and that of negatively charged ligands can increase (for complexes with a negative net charge) or decrease (for positively charged complexes). If the net charge of the complex does not change, there is normally little difference between different metals or different types of complexes. The only exception is observed for sulphur-containing ligands (Met and Cys) and if the ligand is redox-active (e.g. high-valence Fe-O complexes).
机译:我们已经使用密度泛函理论计算来研究使用60多个模型系统(当金属蛋白中经常遇到的六种金属和八种配体)将配体与金属结合时氢键强度的变化。我们研究了氢键的几何形状和能量如何随金属的性质,氧化态,配位数,氢键中涉及的配体,其他第一球配体以及不同的氢键探针分子而变化。结果表明,一般而言,中性配体的氢键强度增加而带负电的配体的氢键强度降低。效应的大小主要由金属络合物的净电荷决定,当溶剂化模型时,所有效应通常都会减小。在水溶液中,中性配体的氢键强度可以提高到37 kJ / mol,带负电的配体的氢键强度可以提高(对于带负净电荷的配合物)或降低(对于带正电的配合物)。如果络合物的净电荷不变,通常在不同金属或不同类型的络合物之间几乎没有差异。对于含硫的配体(Met和Cys)以及配体具有氧化还原活性(例如高价Fe-O络合物),只有一个例外。

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