Curing behavior and thermal property of epoxy resin with boron-containing phenol-formaldehyde resin

摘要

The curing reaction of bisphenol-A epoxy resin (BPAER) with boron-containing phenol-formaldehyde resin (BPFR) was studied by isothermal and dynamic differential scanning calorimetry (DSC). The kinetic reaction mechanism in the isothermal reaction of BPAER-BPFR was shown to follow autocatalytic kinetics. The activation energy in the dynamic cure reaction was derived. The influence of the composition of BPAER and BPFR on the reaction was evaluated. In addition, the glass transition temperatures (T(g)s) were measured for the BPAER-BPFR samples cured partially at isothermal temperatures. With the curing conditions varying, different glass transition behaviors were observed. By monitoring the variation in these T(g)s, the curing process and the thermal property of BPAER-BPFR are clearly illustrated. (C) 2000 John Wiley & Sons, Inc. [References: 9]