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首页> 外文期刊>Journal of Applied Polymer Science >CONSOLIDATION AND SELF-BONDING IN POLY(ETHER ETHER KETONE) (PEEK)
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CONSOLIDATION AND SELF-BONDING IN POLY(ETHER ETHER KETONE) (PEEK)

机译:聚(醚酮)(PEEK)的固结和自键合

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The effects of processing variables (time, temperature, and pressure) on the strength development during self-bonding of amorphous PEEK films were studied using a modified single lap-shear test. It was shown that the self-bonding strength developed isothermally at different bonding temperatures exhibits a linear response with the bonding time raised to the 1/4 power in agreement with Wool's theory. DSC measurement of the crystallinity produced at different bonding conditions demonstrated that even though PEEK specimens contain the same amount of crystallinity, the resultant self-bonding strength is sensitively dependent on bonding history. C-mode scanning acoustic microscopy (C-SAM) was applied to define the effect of the processing variables on wetting of the bonding area during the bonding process. It was shown that, above a threshold pressure (< 17 psi), the degree of wetting depends weakly on time, but not on temperature. SEM analysis revealed that amorphous PEEK films are self-bonded by crystalline growth after diffusion and entanglement of the polymer chains across the interface. The crystalline growth rate across the interface is much higher at higher temperatures, leading to a higher self-bonding strength. The shear fracture surface observations also support the above result. The PEEK specimens showing the higher self-bonding strengths exhibit much denser striations and deeper dimplelike ductile patterns in the fracture surface, arising from much more crystalline growth across the interface. (C) 1995 John Wiley & Sons, Inc. [References: 20]
机译:使用改进的单搭接剪切试验研究了工艺变量(时间,温度和压力)对无定形PEEK薄膜自粘合过程中强度发展的影响。结果表明,在不同的粘合温度下等温发展的自粘合强度表现出线性响应,并且粘合时间提高到1/4幂,符合Wool的理论。 DSC测量在不同粘结条件下产生的结晶度表明,即使PEEK试样包含相同量的结晶度,所得的自粘结强度也敏感地取决于粘结历史。使用C模式扫描声学显微镜(C-SAM)来定义工艺变量对粘接过程中粘接区域润湿的影响。结果表明,高于阈值压力(<17 psi)时,润湿程度在一定程度上取决于时间,但与温度无关。 SEM分析表明,非晶态的PEEK薄膜通过聚合物链扩散和缠结在界面上后,通过晶体生长而自粘。在较高温度下,界面上的晶体生长速率要高得多,从而导致较高的自粘合强度。剪切断面观察也支持上述结果。表现出较高自粘结强度的PEEK样品在断裂表面表现出更密集的条纹和更深的凹坑状延性模式,这是由于界面上更多的晶体生长所致。 (C)1995 John Wiley&Sons,Inc. [参考:20]

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