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首页> 外文期刊>Journal of Applied Crystallography >Measurement of stress factors and residual stress of a film by in situ X-ray diffraction during four-point bending
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Measurement of stress factors and residual stress of a film by in situ X-ray diffraction during four-point bending

机译:四点弯曲过程中原位X射线衍射法测量薄膜的应力因子和残余应力

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摘要

A method is proposed for the simultaneous measurement of the stress factors and residual stress state of a film by in-situ X-ray diffraction during four-point bending. The externally applied load acts as an additional degree of freedom in the stress-strain relation, which allows the problem to be solved for both residual stress and elastic moduli without assuming any grain interaction model. The procedure was tested on a galvanic nickel deposit and the predictions of existing grain interaction models were compared with the experimental results.
机译:提出了一种在四点弯曲过程中通过原位X射线衍射同时测量薄膜应力因子和残余应力状态的方法。外部施加的载荷在应力-应变关系中起到了额外的自由度的作用,这使得在无需假设任何晶粒相互作用模型的情况下,既可以解决残余应力问题,也可以解决弹性模量问题。该程序在电镀镍矿层上进行了测试,并将现有的晶粒相互作用模型的预测与实验结果进行了比较。

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