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首页> 外文期刊>Journal of Applied Crystallography >In situ X-ray diffraction studies of aluminium-induced crystallization of hydrogenated amorphous silicon
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In situ X-ray diffraction studies of aluminium-induced crystallization of hydrogenated amorphous silicon

机译:铝诱导氢化非晶硅结晶的原位X射线衍射研究

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Thin intrinsic hydrogenated amorphous silicon (alpha-Si: H) films (5000 Angstrom thickness) were deposited on (111)-oriented n-type silicon substrates by plasma-enhanced chemical vapor deposition. A 4000 Angstrom thick Al film was then deposited on the alpha-Si: H film by vacuum evaporation. In situ annealing of these films was carried out in an evacuated temperature-controlled ( Model TTK) camera of an X-ray diffractometer at a glancing angle of 5degrees using a thin-film optics attachment. The crystallization behavior of aluminium-capped alpha-Si: H was monitored using the 111 silicon peak as a function of annealing temperature between 273 - 523 K. The results show that aluminium-induced crystallization of alpha-Si: H initiates at a temperature between 413 and 423 K. The crystallization rate increases with increasing temperature, and saturates for an anneal of 30 min at a temperature of 523 K. [References: 16]
机译:通过等离子体增强化学气相沉积法在(111)取向的n型硅衬底上沉积本征氢化非晶硅(alpha-Si:H)薄膜(厚度为5,000埃)。然后通过真空蒸发将4000埃厚的Al膜沉积在α-Si:H膜上。使用薄膜光学附件在X射线衍射仪的抽空温度控制(TTK型)照相机中以5度的掠射角对这些薄膜进行原位退火。使用111硅峰作为273-523 K之间的退火温度的函数,监测了铝封顶的Al-Si:H的结晶行为。结果表明,铝诱导的Al-Si:H的结晶始于200℃至200℃之间的温度。 413和423K。结晶速率随温度升高而增加,并在523 K的温度下退火30分钟达到饱和。[参考文献:16]

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