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首页> 外文期刊>Journal de Physique, IV: Proceedings of International Conference >The effect of flow localization and shear bands development on the structure and mechanical behavior of Cu-4.98 wt.% Ti alloy
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The effect of flow localization and shear bands development on the structure and mechanical behavior of Cu-4.98 wt.% Ti alloy

机译:流动局部化和剪切带发展对Cu-4.98 wt。%Ti合金的组织和力学行为的影响

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Hot compression tests were performed on solution treated (ST) Cu-Ti alloy deformed within a temperature range of 673 K - 1173 K at constant strain rate of 1.4 * 10~(-4) s~(-1). Shear banding, dynamic precipitation and dynamic coarsening have operated simultaneously with different effectiveness depending on the temperature and used strain rate. At low temperature, 673 K, intergranular cracks and flow localization were found to be responsible for the material fracture at ε_t ≈ 0.1 - 0.2. At 873 K and above, a flow stress maximum was followed by monotonic flow softening range. Initial hardening range has resulted from both strain and precipitation hardening. Structural observations leads to the conclusion that an interaction of localized flow and discontinuous precipitation within shear bands was responsible for effective flow stress decrease at large strains. At high deformation temperature, the flow softening of ST samples has resulted from cellular growth and combined effect of flow localization and discontinuous precipitation within sheared area. At high strain rates, the shear banding was found to proceed the precipitation and the initial flow softening has resulted from shear bands development rather than discontinuous precipitation. During deformation at 873 K - 1073 K and low strain rate, discontinuous precipitation was observed since the beginning of the tests and the localized flow was intensified due to particles dynamic coarsening within shear bands. The structural flow localization effects were limited for overaged (OA) and hot deformed samples. During deformation above the solvus temperature, dynamic recrystallization of the material was observed for both ST and OA samples.
机译:对在673 K-1173 K温度范围内以1.4 * 10〜(-4)s〜(-1)恒定应变速率变形的固溶处理(ST)Cu-Ti合金进行了热压缩测试。剪切带,动态降水和动态粗化同时进行,其效果取决于温度和使用的应变率。在673 K的低温下,发现晶间裂纹和流动局部化是造成ε_t≈0.1-0.2时材料断裂的原因。在873 K及更高温度下,最大流动应力之后是单调流动软化范围。初始硬化范围是由应变硬化和沉淀硬化共同引起的。结构观察得出的结论是,在剪切带内局部流动和不连续降水的相互作用是导致大应变时有效降低流动应力的原因。在高变形温度下,ST样品的流动软化是由于细胞生长以及剪切区域内流动局部化和不连续沉淀的综合作用所致。在高应变速率下,发现剪切带开始沉淀,并且初始流动软化是由剪切带的发展而不是不连续的沉淀引起的。在873 K-1073 K变形和低应变率的过程中,自测试开始以来就观察到不连续的析出,并且由于剪切带内的颗粒动态变粗,局部流动加剧了。对于超龄化(OA)和热变形的样品,结构流的局部化作用受到限制。在高于固溶温度的变形过程中,对于ST和OA样品均观察到材料的动态再结晶。

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