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Using Plasma Deposition to Create Unique Protective Coatings for Electronic Applications

机译:使用等离子沉积来创建用于电子应用的独特保护涂层

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摘要

The copper surfaces J of printed circuit boards (PCBs)-both bare and containing components-need to be protected from corrosion that can result in the harsh manufacturing environment. Typically, various metal layers are used, depending on the level of hardness and protection required. However, that approach can be expensive and time-consuming. One company-Semblant-is tackling this problem with novel fluoropolymer coatings that are deposited using a plasma polymer process. The purpose of PCBs is to enable the connection of important electronic components within electronic devices. They typically consist of as many as 20 layers of metal separated by different dielectric materials. Each layer is patterned individually and then they are laminated together, with the top and bottom layers being exposed metal. Often copper is used since it is inexpensive and serves as a good conductor. Once manufactured, the bare PCBs are shipped to other facilities where they are used for the assembly of electronic devices.
机译:印刷电路板(PCB)的铜表面J既裸露又包含组件,需要加以保护以防腐蚀,这会导致恶劣的制造环境。通常,根据所需的硬度和保护等级,使用各种金属层。但是,该方法可能既昂贵又耗时。一个公司-Semblant-正在通过使用等离子聚合物工艺沉积的新型含氟聚合物涂料解决这一问题。 PCB的目的是实现电子设备中重要电子组件的连接。它们通常由多达20层金属组成,这些金属被不同的介电材料隔开。每层分别进行构图,然后将它们层压在一起,顶层和底层是裸露的金属。通常使用铜,因为它便宜并且可以用作良好的导体。裸露的PCB制造完成后,将被运送到其他设施,用于组装电子设备。

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