TLP bonding of SiC particle reinforced Al-based composite and aluminum alloy

摘要

SiC particle reinforced Al-based composite is widely used in the important areas such as aeronautics and astronautics, but the bonding technology severely limits its application. The TLP bonding experiment of SiCp-AI composite and Aluminium alloy is carried out, some influence factors on the bonds properties are analyzed, the microstructure of the bond is observed using SEM, and the concentration profiles of various elements are measured by means of EDS technology. The research indicated that the mechanical property of TLP bond of SiCp-6061 Al composite with 5056AI is prior to that of SiCp-2024AI composite with 5056AI under the same bonding parameters. And too long bonding time will obviously decrease the bonds properties. From the microscopic analysis, it is found that the concentration profile of various elements distribute fairly asymmetrically in the joint area, especially, the concentration of Cu element becomes less gradually from the interface to the composite side, however, it almost disappears from the interface to 5056AI side. The reason is that the diffusion coeffecient of Cu element in SiCp-AI is much bigger than that in 5056AI, so during isothermal solidification, much Cu atoms diffuse into composite.