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Microstructure of thermal sprayed silicon coatings using various particle sizes and spray conditions

机译:使用各种粒径和喷涂条件的热喷涂硅涂层的微观结构

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Silicon based coatings are showing great promise for power applications in the semiconductor, target, and solar industries. In order for thermal plasma spraying of silicon to continue to have an industrial impact in these industries, careful investigations into the deposition properties must be undertaken. We used a Thermach gun and powder feeder, to deposit silicon onto 100 mm×50 mm×1.6 mm steel samples. Coating cross-sectioning and image analysis was performed in order to evaluate the coating's microstructure and porosity. Mechanical property measurements consisted of hardness testing on the coating cross sections. In addition, scanning electron microscopy and optical microscopy were conducted. These results combined for an analysis into the deposition properties of silicon coatings using various particle sizings, plasma power, and spray distances. Correlations between these input parameters and their effect on the microstructure are critical to semiconductor depositions of silicon.
机译:硅基涂料在半导体,靶材和太阳能行业的电力应用中显示出巨大的希望。为了使硅的热等离子体喷涂继续在这些行业中产生工业影响,必须对沉积性能进行仔细研究。我们使用Thermach喷枪和粉末进料器将硅沉积到100 mm×50 mm×1.6 mm的钢样品上。为了评估涂层的微观结构和孔隙率,进行了涂层横截面和图像分析。机械性能测量包括在涂层横截面上进行硬度测试。另外,进行了扫描电子显微镜和光学显微镜。这些结果结合起来,可以分析使用各种粒径,等离子功率和喷涂距离的硅涂层的沉积性能。这些输入参数之间的相关性及其对微结构的影响对于硅的半导体沉积至关重要。

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