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Structure and optical properties of Cu-DLC composite films deposited by cathode arc with double-excitation source

机译:阴极电弧双激发源沉积Cu-DLC复合膜的结构和光学性能

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摘要

Copper-doped diamond-like carbon films (Cu-DLC) were fabricated on silicon and quartz substrates by cathode arc technique with direct-current and pulse double-excitation source. The microstructure, composition, morphology, hardness and optical properties of the films were studied by Raman, XPS, AFM and SEM, UV-Vis, laser ellipsometer and Vickers sclerometer. The results showed that Cu doping increases the size, ordering and amount of sp(2)-C clusters in the Cu-DLC composite films. The microstructure parameters enhance with increasing the Cu content to 22.4 wt%. All the films show specific nano-structural surface, however, the lower Cu content induces finer particle formation in the Cu-DLC films. When the arc current is higher than 60 A, the roughness and particle size of Cu-DLC composite films increase with increasing the Cu content. The average transmittance of the Cu-DLC films in Vis-NIR region is smaller than 40% when the Cu content exceeds 12.6 wt%. With increasing the Cu content, the optical band gap (E-g) of the films decreases from 3.54 eV to 0.25 eV. The relationships among the E-g, refractive index and extinction coefficient for the Cu-DLC films were found and indirectly revealed the correlation of microstructure and optical properties of the films with the Cu content variation. (C) 2016 Elsevier B.V. All rights reserved.
机译:采用直流和脉冲双激源阴极电弧技术在硅和石英衬底上制备了铜掺杂类金刚石碳膜(Cu-DLC)。通过拉曼光谱,XPS,AFM和SEM,UV-Vis,激光椭偏仪和维氏硬度计对薄膜的微观结构,组成,形貌,硬度和光学性能进行了研究。结果表明,Cu掺杂会增加Cu-DLC复合膜中sp(2)-C团簇的大小,有序性和数量。随着Cu含量增加到22.4wt%,微结构参数增强。所有膜均显示特定的纳米结构表面,但是,较低的Cu含量会导致Cu-DLC膜中形成更细的颗粒。当电弧电流高于60A时,Cu-DLC复合膜的粗糙度和粒径随着Cu含量的增加而增加。当Cu含量超过12.6wt%时,Vis-NIR区域中的Cu-DLC膜的平均透射率小于40%。随着Cu含量的增加,膜的光学带隙(E-g)从3.54eV降低至0.25eV。发现了Cu-DLC薄膜的E-g,折射率和消光系数之间的关系,并间接揭示了薄膜的微观结构和光学性能与Cu含量变化之间的关系。 (C)2016 Elsevier B.V.保留所有权利。

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