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首页> 外文期刊>Zeitschrift fur Naturforschung, B. A Journal of Chemical Sciences >Electrodeposition and corrosion resistance of Zn-Pd alloy from the ZnCl2-EMIC(1-ethyl-3-methylimidazolium chloride)-PdCl2 room temperature molten salt
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Electrodeposition and corrosion resistance of Zn-Pd alloy from the ZnCl2-EMIC(1-ethyl-3-methylimidazolium chloride)-PdCl2 room temperature molten salt

机译:ZnCl2-EMIC(1-乙基-3-甲基咪唑鎓氯化物)-PdCl2室温熔融盐对Zn-Pd合金的电沉积和耐蚀性

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摘要

Electric conductivities of 50-50 mol% ZnCl2-EMIC and its mixtures with 0.6714 mol% PdCl2 room-temperature molten salts (RTMS) have been measured by a computerized system based on a d.c. four-probe method. The conductivity of the former is greater than that of the latter. These conductivities are well fitted by Arrhenius equations and the activation energies are calculated to be 25.22 and 26.28 KJ/mol, respectively. Cyclic voltammetry for the ZnCl2-EMIC-PdCl2 melt has been performed on Pt and Cu working electrodes. The cathodic reduction waves of Pd2+ and Zn2+ species and the oxidation waves for Zn-Pd alloys rich in Zn and I'd have been observed for the cyclic voltammograms on the Pt working electrode. The deposition potentials have been measured to be -0.7 V and -1.3 V on the Cu substrate. The morphology and composition of the electrodeposited layers obtained under different conditions have been analyzed by SEM and EDS, respectively; layers with a finer (about 300 - 500 nm), denser and higher Pd content have been obtained by pulse plating on the Cu sheet at t(on)/t(off) 3/1 under -0.7 V at 80 degreesC. The XRD patterns also reveal that the structure of these deposited layers can be regarded as amorphous. Tafel polarization curves of the electrodeposited layers in 3.5 wt% NaCl solution have been drawn. The results indicate that the Zn-Pd alloy deposits have much higher corrosion resistance and protection efficiency than the Zn-deposited layer; the corrosion potentials shift positively by about 700 similar to 950 mV. Furthermore, the pulse plating has a better performance than the direct current plating, and the reason is discussed. [References: 27]
机译:已经通过基于直流电的计算机化系统测量了50-50 mol%ZnCl2-EMIC及其与0.6714 mol%PdCl2室温熔融盐(RTMS)的混合物的电导率。四探针法。前者的电导率大于后者。这些电导率可以通过Arrhenius方程很好地拟合,并且活化能分别计算为25.22 KJ / mol和26.28 KJ / mol。 ZnCl2-EMIC-PdCl2熔体的循环伏安法已在Pt和Cu工作电极上进行。对于Pt工作电极上的循环伏安图,已经观察到Pd2 +和Zn2 +物种的阴极还原波以及富含Zn和I'd的Zn-Pd合金的氧化波。据测量,在铜基板上的沉积电势为-0.7 V和-1.3V。通过SEM和EDS分别分析了在不同条件下获得的电沉积层的形态和组成。通过在80℃下于-0.7 V下以t(on)/ t(off)3/1脉冲镀在Cu板上,可以获得具有更细(约300-500 nm),更致密和更高Pd含量的镀层。 XRD图谱还表明,这些沉积层的结构可以被认为是非晶的。绘制了在3.5 wt%NaCl溶液中电沉积层的Tafel极化曲线。结果表明,Zn-Pd合金镀层的耐蚀性和保护效率均高于Zn镀层。腐蚀电位正向移动约700到950 mV。此外,脉冲镀覆具有比直流镀覆更好的性能,并讨论了原因。 [参考:27]

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