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HYDROGEN BONDING IN WOOD-BASED MATERIALS: AN UPDATE

机译:木质材料中的氢键结合:一个更新

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The contribution of hydrogen bonding to wood science and technology has been well recognized over the past century. The hydrogen bond is an important chemical characteristic contributing to wood-based material behavior and it also provides an important contribution to processing features of wood. However, the current understanding of hydrogen bond strength as a contributor to wood-based material behavior has not been updated in the wood literature. Wood-based material literature typically report hydrogen bond strengths ranging from 12.6 to 25.2 kJ/mol (3-6 kcal/mol) while newer data from the general chemistry field report hydrogen bond strengths up to 189 kJ/mol (45 kcal/mol), which are characteristic of covalent bond strength. In light of these new data regarding hydrogen bond strengths, it provides impetus to discuss the new understanding of hydrogen bond strength relative to wood-based material behavior. Recent developments in nanotechnology of renewable materials leading to the production and applications of cellulose nanomaterials with much higher surface areas and hydrogen bonding capacity also mandate revisiting our knowledge of the hydrogen bonding mechanism and strength.
机译:在过去的一个世纪中,氢键对木材科学和技术的贡献得到了公认。氢键是重要的化学特征,有助于木质材料的行为,也为木材的加工特性提供重要的贡献。但是,目前对氢键强度是导致木质材料行为的因素的理解在木材文献中尚未更新。木质材料文献通常报告的氢键强度范围为12.6至25.2 kJ / mol(3-6 kcal / mol),而来自常规化学领域的最新数据报告的氢键强度高达189 kJ / mol(45 kcal / mol) ,这是共价键强度的特征。根据有关氢键强度的这些新数据,它为讨论氢键强度相对于木质材料行为的新理解提供了动力。可再生材料纳米技术的最新发展导致具有更高表面积和氢键合能力的纤维素纳米材料的生产和应用,也要求我们重新认识氢键合机理和强度。

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