首页> 外文期刊>Welding in the World: Journal of the International Institute of Welding: Journal of the International Institute of Welding >Characterization and growth kinetics of the formation of intermetallic compounds in the liquid state during soldering with lead-free solders
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Characterization and growth kinetics of the formation of intermetallic compounds in the liquid state during soldering with lead-free solders

机译:无铅焊料焊接过程中液态金属间化合物形成的表征和生长动力学

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The research described in this paper developed the experimental techniques necessary for promoting intermetallic layer growth throughout the melting and solidification cycle of the solder and then measuring the thickness of these layers. Most of the literature to date reported on aged soldered joints to investigate in-service intermetallic layer growth. To observe intermetallic compound (IMC) growth during the liquid state of soldering required an experimental setup that quickly raises the temperature of the solder joint followed by fast cooling (comparable to the actual joint conditions). Temperatures at increments of 25 degrees above the soldering temperature and times of 2, 5, and 8 s for growth were carefully controlled. After the experiments, the copper substrate/solder alloy interface was examined using light microscopy, scanning electron microscopy (SEM), and SEM-EDS (energy dispersive spectroscopy). As expected, intermetallic phases such as Cu6Sn5, Cu3Sn, and Ag3Sn were observed, with Cu6Sn5 being the major phase. Statistical analysis was performed for the IMC thickness data obtained from the long profile analysis. Empirical equations capable of predicting the IMC layer thicknesses were determined. Using Arrhenius analysis, the activation energy for intermetallic layer growth was calculated to be approximately 7 kCal/mol. This value is significantly lower than the value of approximately 24 kCal/mol reported in the literature for Cu6Sn5. Even considering the presence of Cu3Sn (counted together with Cu6Sn5) which has about 15 % higher activation energy of formation than Cu6Sn5, the experimentally measured values were still lower. The discrepancy was attributed to the fact that the values reported in the literature were mostly based on solid-state transformations while the measurements and calculations in this work were limited to the intermetallic layer formation from liquid state followed by growth.
机译:本文所述的研究开发了在焊料的整个熔化和固化周期中促进金属间层生长并随后测量这些层的厚度所必需的实验技术。迄今为止,大多数文献报道了老化的焊接接头以研究在役金属间层的生长。为了观察液态焊接过程中金属间化合物(IMC)的生长,需要进行实验设置,该设置可以快速提高焊点的温度,然后快速冷却(与实际的焊点条件相比)。小心地控制了比焊接温度高25度的温度以及2、5和8 s的生长时间。实验之后,使用光学显微镜,扫描电子显微镜(SEM)和SEM-EDS(能量色散光谱)检查了铜基板/焊料合金的界面。正如预期的那样,观察到金属间相,例如Cu6Sn5,Cu3Sn和Ag3Sn,其中Cu6Sn5是主要相。对从长剖面分析中获得的IMC厚度数据进行统计分析。确定了能够预测IMC层厚度的经验方程。使用Arrhenius分析,计算出金属间层生长的活化能约为7 kCal / mol。该值明显低于文献中报道的Cu6Sn5的大约24 kCal / mol的值。即使考虑到存在的Cu3Sn(与Cu6Sn5一起计算),其形成活化能比Cu6Sn5高约15%,但实验测量值仍然较低。差异归因于以下事实:文献中报道的值主要基于固态转变,而这项工作中的测量和计算仅限于从液态到随后生长的金属间层形成。

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