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Characterisation of graphite nanoplatelets and the physical properties of graphite nanoplatelet/silicone composites for thermal interface applications

机译:石墨纳米片的表征以及用于热界面应用的石墨纳米片/硅氧烷复合材料的物理性能

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Thermally conducting and highly compliant composites were developed by dispersing graphite nanoplatelets (GNPs) into a silicone matrix by mechanical mixing. X-ray diffraction (XRD) indicates that the average thickness of the GNPs decreased from 60 to 35 nm during mechanical mixing. XRD-texture analysis demonstrated that GNP/silicone composites at 8 wt.% GNPs have a higher degree of basal plane alignment than at 20 wt.%. Differential scanning calorimetry showed that GNPs raised the curing temperature of silicone with no significant effect on the glass transition temperature. The thermal conductivity of the 20 wt.% composites reached 1.909 W/m.K, an 11-fold increase over silicone suggesting an improved dispersion compared to similar composites prepared by dual asymmetric centrifuge mixing. The percolation threshold for electrical conductivity of the composites was at ~15 wt.%. The compressive modulus of the composite increased to twice that of silicone at 20 wt.%. The corresponding strength decreased by a factor of two compared to silicone and this can be attributed to the weak bonding at the GNP-silicone interface. Overall, these GNP/silicone composites, with a high thermal conductivity, low electrical conductivity and compliant nature are promising materials for use as thermal pads for thick gap filling thermal interface applications.
机译:通过机械混合将石墨纳米片(GNP)分散到有机硅基质中,从而开发出导热性和高柔顺性的复合材料。 X射线衍射(XRD)表明,在机械混合过程中,GNP的平均厚度从60nm降低至35nm。 XRD纹理分析表明,GNP /硅氧烷复合物在GNP为8重量%时比在20重量%时具有更高的基底平面取向度。差示扫描量热法显示,GNP提高了有机硅的固化温度,而对玻璃化转变温度没有显着影响。 20%(重量)复合材料的热导率达到1.909 W / m.K,是硅树脂的11倍,这表明与通过双不对称离心混合制备的类似复合材料相比,分散性得到了改善。复合材料的电导率的渗透阈为〜15重量%。复合材料的压缩模量增加到20%(重量)时硅树脂的两倍。与硅树脂相比,相应的强度降低了两倍,这可以归因于GNP-硅树脂界面处的弱结合。总体而言,这些具有高导热率,低导电率和顺应性的GNP /有机硅复合材料是有希望的材料,可用作厚间隙填充热界面应用的导热垫。

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