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首页> 外文期刊>Tsvetnye Metally: The Soviet Journal of Non-Ferrous Metals >DEVELOPMENT AND CURRENT STATE OF ELECTROLYTIC COPPER FOIL PRODUCTION
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DEVELOPMENT AND CURRENT STATE OF ELECTROLYTIC COPPER FOIL PRODUCTION

机译:电解铜箔生产的发展与现状

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摘要

At the start of the 1950s, with the appearance of transistors in both the Soviet Union and abroad, there was rapid development of copper foil production for printed circuits. Foil production for printed circuits involved two basic operations: production of copper strip - the so-called "raw" foil - and treating the foil surface to give it the required properties. The method used during those years o producing copper foil from sulfate electrolytes in rotary electrolyzers with a stainless steel cathode and soluble anodes - still do not meet foil quality requirements. By the 1970s all the leading foreign firms ("White Industries", Gould (USA), etc.) had switched to producing foil by a more progressive technology - using electrolyzers with insoluble anodes. This method'makes it possible to stabilize technological parameters during the production process, to intensify the process, and simplifies industrial conversion to automated control.
机译:1950年代初,随着晶体管在苏联国内外的出现,印刷电路用铜箔生产得到了飞速发展。印刷电路箔的生产涉及两个基本操作:铜带(即所谓的“原始”箔)的生产,以及对箔表面进行处理以使其具有所需的性能。那些年中使用的方法o在带有不锈钢阴极和可溶阳极的旋转电解槽中由硫酸盐电解质生产铜箔-仍然不能满足箔的质量要求。到1970年代,所有领先的外国公司(“白色工业”(White Industries),古尔德(美国)等)都已开始采用更先进的技术生产箔纸-使用带有不溶性阳极的电解槽。这种方法使得在生产过程中稳定技术参数,加强过程,简化从工业到自动化控制的转换成为可能。

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