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TEMPERATURE DISTRIBUTION IN SILICON-ALUMINUM THIN FILMS WITH PRESENCE OF THERMAL BOUNDARY RESISTANCE

机译:有热边界电阻的硅铝薄膜的温度分布

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摘要

Phonon transport in two-layer films, consisting of silicon and aluminum, is considered. Phonon radiative energy transfer is incorporated to predict equilibrium temperature distribution in the silicon film, while the modified two-equation model is used to predict electron and phonon temperatures in the aluminum film. The thermal boundary resistance is introduced at the interface of both films. Equilibrium temperature decay is found to be sharp in the early heating period in the silicon film. Phonon temperature remains higher than electron temperature in the vicinity of the interface of aluminum film. Electron and phonon temperature become the same at mid-thickness of the aluminum film.
机译:考虑了由硅和铝组成的两层薄膜中的声子传输。引入了声子辐射能量转移,以预测硅膜中的平衡温度分布,同时使用改进的两方程模型预测铝膜中的电子和声子温度。在两个膜的界面处都引入了热边界电阻。发现在硅膜的早期加热期间,平衡温度的衰减非常明显。在铝膜界面附近,声子温度仍高于电子温度。电子和声子的温度在铝膜的中间厚度处相同。

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