Induction Heating of Solder Ball Leads for Assembly of BGA Packages

摘要

The process of induction heating for the formation of solder ball leads of solder pastes on the con tact pads of printed circuit board is investigated. The application of annular inductors with internal ferrite magnetic core has allowed us to concentrate magnetic field lines in the working zone and ensure an optimum temperature profile of heating at a rate of 40-50°C/s while assembling BGA packages.