Thermoelectric measurements for bondability analysis of bond pads: A new concept for a bondability analyzer

摘要

We present a new apparatus to determine the ultrasonic wire bonding behaviour of different contact materials. The basic principle of the developed bondability analyzer is measurement of the temperature at the bond ball during the ultrasonic friction process by using a thermocouple instead of a bond wire. We tested the bondability analyzer by analyzing different bond pads with high and low bond contact quality and comparing the results with pull force measurements of the wire bond. The results show that the bondability analyzer characterizes the ultrasonic wire bonding behaviour of bond pads perfectly. In addition, the apparatus allows the wire bonding process to be studied in detail and in real time.