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Examination of the interface of a model adhesive joint by surface analysis: a study by XPS and ToF-SIMS

机译:通过表面分析检查模型粘合剂接头的界面:XPS和ToF-SIMS的研究

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摘要

Model samples of the interface of an adhesive joint containing small levels of aminopropyl triethoxysilane (APS) have been prepared in order to examine the interface formed with an aluminium substrate. X-ray photoelectron spectroscopy (XPS) and time of flight secondary ion mass spectrometry (ToF-SIMS) have been used to analyse and image the interface region in between the aluminium and an epoxy adhesive in order to ascertain the reactions by the organosilane which is present as a minor component within the system. It was found that APS was present at the interface between the adhesive and the substrate and that it had reacted with the substrate forming a covalent bond and was also crosslinked within the adhesive. Evidence of near to full hydrolysis of APS is also present within the spectra.
机译:为了检查与铝基底形成的界面,已经制备了含有少量氨基丙基三乙氧基硅烷(APS)的粘合剂接头的界面模型样品。 X射线光电子能谱(XPS)和飞行时间二次离子质谱(ToF-SIMS)已用于分析和成像铝和环氧粘合剂之间的界面区域,以确定由有机硅烷引起的反应。在系统中作为次要组件存在。发现APS存在于粘合剂和基材之间的界面处,并且它已经与基材反应形成共价键,并且还在粘合剂内交联。光谱中还存在APS几乎完全水解的证据。

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