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Investigation of dominating factors on flattening behavior of plasma sprayed ceramic particles

机译:等离子喷涂陶瓷颗粒扁平化行为的主要影响因素研究

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In previous works, we have shown that splat morphology of the most metallic materials, which are thermally sprayed, depends strongly on the substrate temperature and that a drastic change usually occurs near the transition temperature, T{sub}t. In this study, the effects of the substrate, powder and pre-coating by PVD on the flattening of the plasma sprayed ceramic particles were investigated. Several kinds of ceramic powders were sprayed onto the mirror polished substrate surface. The substrates were held at a designated temperature before spraying. To investigate the effect of wetting on the flattening of the particle, substrates coated with Au, Ti and Al by PVD were also prepared. The splat morphology was a splash type at room temperature. As the substrate temperature increased, the central solidification area of the splash splat gradually enlarged, and finally the splat morphology changed to a disk type at temperatures greater than T{sub}t. This transition may be caused by the improvement of the wettability at the splat-substrate interface and the suppression of rapid solidification as the substrate temperature increased. Different transition behavior was observed on the common substrate material with various PVD coatings. It is well known that the standard free energy of formation of the oxide can be closely related to the static wetting of melt material on the substrate. If this relationship is applicable to dynamic wetting as plasma sprayed particles on the substrate, our results indicate that better wetting promotes the occurrence of the disk splat. Observation of the bottom surface microstructure of the splats supports this hypothesis. Consequently, it has been clarified that the wetting plays an important role on the flattening behavior of the plasma sprayed ceramic particles.
机译:在先前的工作中,我们已经表明,大多数金属材料(经热喷涂)的飞溅形态在很大程度上取决于基底温度,并且通常会在转变温度T {sub} t附近发生剧烈变化。在这项研究中,研究了基材,粉末和PVD的预涂对等离子喷涂陶瓷颗粒扁平化的影响。将几种陶瓷粉末喷涂到镜面抛光的基材表面上。在喷涂之前,将基材保持在指定温度下。为了研究润湿对颗粒扁平化的影响,还制备了通过PVD涂覆Au,Ti和Al的基材。飞溅的形态在室温下为飞溅型。随着基底温度的升高,飞溅飞溅的中心凝固区域逐渐扩大,最终飞溅形态在温度大于T {sub} t时变为盘状。这种转变可能是由于splat-基板界面处的润湿性提高以及随着基板温度升高而抑制的快速凝固所引起的。在带有各种PVD涂层的普通基材上观察到了不同的过渡行为。众所周知,氧化物形成的标准自由能可能与熔融材料在基材上的静态润湿密切相关。如果这种关系适用于动态润湿,如在基板上进行等离子喷涂的粒子,则我们的结果表明,更好的润湿会促进磁盘飞溅的发生。对小片的底部表面微观结构的观察支持了该假设。因此,已经弄清,润湿对等离子喷涂陶瓷颗粒的扁平化行为起重要作用。

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