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首页> 外文期刊>The journal of physical chemistry, B. Condensed matter, materials, surfaces, interfaces & biophysical >A Surface Science Study of Model Catalysts. 2. Metal-Support Interactions in Cu/SiO_2 Model Catalysts
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A Surface Science Study of Model Catalysts. 2. Metal-Support Interactions in Cu/SiO_2 Model Catalysts

机译:模型催化剂的表面科学研究。 2. Cu / SiO_2模型催化剂中的金属-载体相互作用

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摘要

The thermal stability of wet-chemically prepared Cu/SiO_2 model catalysts containing nanometer-sized Cu particles on silica model supports was studied upon heating in hydrogen and ultrahigh vacuum. The surface and interface phenomena that occur are determined by the metal-support interactions. Heating in hydrogen results in a reduction of the metal-support interaction and sintering occurs via Cu particle migration at 350 ℃. Annealing in ultrahigh vacuum up to 620 ℃ does not result in sintering of the Cu particles. When a 5 nm thin SiO_2 layer on top of a Si(100) substrate is used as SiO_2 model support, interdiffusion of Cu into the Si substrate takes place. For a 400-500 nm thick SiO_2 layer, Cu silicide islands are formed by reaction between Cu and SiO_2, which can be regenerated by exposure to air at room temperature for several hours. The importance of the preparation procedure for the strength of the metal-support interaction is discussed. This paper shows that the use of model catalysts to study surface and interface phenomena is relevant for technical heterogeneous metal catalysis.
机译:通过在氢气和超高真空下加热,研究了湿法化学制备的在二氧化硅模型载体上包含纳米级Cu颗粒的Cu / SiO_2模型催化剂的热稳定性。发生的表面和界面现象取决于金属与载体的相互作用。在氢气中加热会降低金属与载体之间的相互作用,并且由于铜颗粒在350℃下的迁移而发生烧结。在高达620℃的超高真空中进行退火不会导致Cu颗粒的烧结。当将Si(100)衬底顶部的5 nm薄SiO_2层用作SiO_2模型载体时,会发生Cu相互扩散到Si衬底中。对于400-500 nm厚的SiO_2层而言,铜硅化物岛是通过铜与SiO_2之间的反应形成的,可以通过在室温下暴露于空气中几个小时来再生。讨论了制备程序对于金属-载体相互作用强度的重要性。本文表明,使用模型催化剂研究表面和界面现象与技术上的多相金属催化有关。

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