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首页> 外文期刊>The Journal of Adhesion >Study of Influence of Substrate Topography on Stress Distribution in Structural Adhesive Joints
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Study of Influence of Substrate Topography on Stress Distribution in Structural Adhesive Joints

机译:基底形貌对结构胶接点应力分布影响的研究

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摘要

This paper analyses the influence of surface roughness on adhesive bond strength. Numerical simulations were performed to evaluate the influence of geometry on the performance of structural adhesive joints. The objective is to create a model to describe the behaviour of the interphase of adhesive joints according to its geometry. Two-dimensional simulations with theoretical geometries were performed considering parameters of roughness, stress distribution, and contact area to verify the qualitative influence of substrate topography on the adhesion of a joint. Numerical analyses were done to verify the effect of the interpenetration of materials on the mechanical properties of the interphase.
机译:本文分析了表面粗糙度对粘接强度的影响。进行了数值模拟,以评估几何形状对结构粘合接头性能的影响。目的是创建一个模型,以根据其几何形状描述粘合接头的相间行为。考虑到粗糙度,应力分布和接触面积的参数,进行了具有理论几何形状的二维模拟,以验证基板形貌对接缝粘附性的定性影响。进行了数值分析,以验证材料互穿对相间机械性能的影响。

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