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首页> 外文期刊>The Journal of Adhesion >Effect of Bondline Thickness on Mixed-Mode Fracture of Adhesively Bonded Joints
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Effect of Bondline Thickness on Mixed-Mode Fracture of Adhesively Bonded Joints

机译:粘结层厚度对胶接接头混合模式断裂的影响

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摘要

The effect of bondline thickness on the critical strain energy release rate (CSERR) was investigated using aluminum adherends and an epoxy adhesive. Complete mixed Mode I/II fracture envelopes for adhesive thicknesses ranging from 0.203 to 1.52 mm were developed using double cantilever beam (DCB), mixed-mode bending (MMB), and end notch flexure (ENF) tests methods. Bondline thickness strongly affects the CSERR for different amounts of Mode II component. Pure Mode II had the largest CSERR and showed monotonic increase with bondline thickness, whereas pure Mode I had the lowest CSERR and exhibited non mono-tonic relationship with bondline thickness. The shape and size of the plastic zone that develops prior to crack propagation was predicted by finite element analysis. Variation of CSERR as a function of adhesive layer thickness was shown to be related to the size of the plastic zone for Mode I and MMB 50% fracture. No correlation was observed for the MMB 75% and Mode II, however.
机译:使用铝被粘物和环氧胶粘剂研究了键合线厚度对临界应变能释放速率(CSERR)的影响。使用双悬臂梁(DCB),混合模式弯曲(MMB)和端部切口挠曲(ENF)测试方法,开发出厚度范围为0.203至1.52 mm的完全I / II混合模式I / II断裂包络线。对于不同数量的Mode II组件,接合线的厚度会严重影响CSERR。纯模式II具有最大的CSERR并显示出随键合线厚度的单调增加,而纯模式I具有最低的CSERR并显示出与键合线厚度的非单调关系。通过有限元分析可以预测在裂纹扩展之前形成的塑性区的形状和大小。结果表明,CSERR随胶粘剂层厚度的变化与模式I和50%MMB断裂塑性区的大小有关。但是,MMB 75%和模式II未观察到相关性。

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