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A Scientist's Perspective on the Early Days of MOS Technology

机译:MOS技术早期的科学家观点

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In September 1957, Frosch and Derick of Bell Telephone Laboratories. published a seminal paper in the journal of The Electrochemical Society concerning the use of silicon dioxide as a selective mask against dopant diffusion into silicon wafers. This oxide layer was soon shown to passivate the underlying p-n junctions. Subsequent Bell Labs work involved the fabrication of both bipolar and the newly developed metal-oxide-semiconductor, or MOS, transistors. At about the same time, Jean Hoerni of Fairchild Semiconductor Corporation in Palo Alto, California, developed the so-called planar process, in which the diffused junctions were left covered by the masking oxide during subsequent device fabrication and operation. This process quickly began to revolutionize the semiconductor industry.
机译:1957年9月,贝尔电话实验室的Frosch和Derick。在《电化学学会》杂志上发表了一篇开创性论文,内容涉及使用二氧化硅作为选择性掩膜,以防止掺杂剂扩散到硅片中。该氧化物层很快被证明可以钝化下面的p-n结。贝尔实验室随后的工作涉及双极晶体管和新开发的金属氧化物半导体或MOS晶体管的制造。大约在同一时间,位于加利福尼亚州帕洛阿尔托的Fairchild Semiconductor Corporation的Jean Hoerni开发了所谓的平面工艺,其中在随后的器件制造和操作过程中,扩散的结被掩蔽氧化物覆盖。此过程迅速开始彻底改变半导体行业。

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