首页> 外文期刊>The Electrochemical Society interface >P1 - FIFTH INTERNATIONAL SYMPOSIUM ON ENVIRONMENTAL ISSUES WITH MATERIALS AND PROCESSES FOR THE ELECTRONIC AND SEMICONDUCTORS INDUSTRIES
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P1 - FIFTH INTERNATIONAL SYMPOSIUM ON ENVIRONMENTAL ISSUES WITH MATERIALS AND PROCESSES FOR THE ELECTRONIC AND SEMICONDUCTORS INDUSTRIES

机译:P1-第五届国际电子和半导体工业用材料和过程环境问题研讨会

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摘要

As semiconductor technology advances, new materials, tools, and processes are being introduced at an unprecedented rate. It is critical to identify and address the environmental, health, and safety (EHS) issues associated with these new processes as early on in development as possible. Furthermore, recent increases in environmental awareness, such as climate change and resource conservation, will have a significant effect on the process technologies used for electronics and semiconductor manufacturing. This symposium will focus on the EHS issues prevalent in these industries and the solutions developed to addres these issues. Potential topics include waste treatment, recycle and reclaim, emissions abatement, and alternative chemistries and processes. Some suggested process areas of focus are as follow: metallization, advanced CVD of low-k and high-k dielectric materials, CMP, wet and dry etch chemistries, wafer cleaning, etch chemistries, photolithography, circuit board manufacturing, plating and soldering processes, and encapsulation processes.
机译:随着半导体技术的发展,以前所未有的速度引入了新的材料,工具和工艺。尽早在开发中识别并解决与这些新过程相关的环境,健康和安全(EHS)问题至关重要。此外,最近环境意识的提高,例如气候变化和资源节约,将对用于电子和半导体制造的工艺技术产生重大影响。本次研讨会将集中讨论这些行业中普遍存在的EHS问题以及为解决这些问题而开发的解决方案。潜在的主题包括废物处理,回收和再利用,减排以及其他化学方法和工艺。建议的重点处理领域如下:金属化,低k和高k电介质材料的高级CVD,CMP,湿法和干法蚀刻化学,晶片清洁,蚀刻化学,光刻,电路板制造,电镀和焊接工艺,和封装过程。

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