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Effects of irradiation damage on the back-scattering of electrons: Silicon-implanted silicon

机译:辐照损伤对电子的反向散射的影响:硅注入的硅

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摘要

Radiation damage in a (initially crystalline) silicon wafer was generated by microbeam ion implantation with 600 keV Si+ ions (fluence 5 x 10(14) ions/cm(2)). To produce micro-areas with different degrees of damage, 14 implantations at different temperatures (between 23 and 225 degrees C) were done. The structural state of irradiated areas was characterized using Raman spectroscopy and electron back-scatter diffraction. All irradiated areas showed strong structural damage in surficial regions (estimated depth < 1 mu m), and at implant substrate temperatures of below 130 degrees C, the treatment caused complete amorphization. Back-scattered electron (BSE) image intensities correlate with the degree of irradiation damage; all irradiated areas were higher in BSE than the surrounding host. Because there were no variations in the chemical composition and, with that, no <(Z)over bar> contrast in our sample, this observation again supports the hypothesis that structural radiation damage may strongly affect BSE images of solids.
机译:通过用600 keV Si +离子(注量5 x 10(14)离子/ cm(2))进行微束离子注入,在(初始晶体)硅晶片中产生了辐射损伤。为了产生具有不同程度损坏的微区,在不同温度(23到225摄氏度)下进行了14次注入。使用拉曼光谱和电子背散射衍射来表征受辐照区域的结构状态。所有受辐照的区域在表层区域(估计深度<1微米)均显示出强烈的结构破坏,并且在低于130摄氏度的植入物衬底温度下,该处理导​​致了完全非晶化。背散射电子(BSE)图像强度与辐射损伤的程度有关;疯牛病的所有照射区域都比周围的宿主高。因为在我们的样品中化学成分没有变化,并且因此没有<(Z)over bar对比,所以该观察再次支持以下假设:结构性辐射损伤可能会严重影响固体的BSE图像。

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