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Microwave curing of an epoxy-amine system: effect of curing agent on the glass-transition temperature

机译:环氧胺体系的微波固化:固化剂对玻璃化温度的影响

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Increasing demands on industrial applications in the microelectronics industries have led to the need for accelerated curing of high-performance structural adhesive systems like epoxies. The curing of such thermoset systems has become the bottleneck of the whole production process. Recently, microwave curing has been shown to be a viable alternative as an accelerated curing system. This paper investigates the effect of using different curing agents in microwave curing of an epoxy system on the final cured glass-transition temperature (T-g). Microwave radiation and thermal heating were performed on a diglycidyl ether of bisphenol-A (DGEBA). The three curing agents used were 4,4 ' -diaminodiphenylsulfone (DDS), 4,4 ' -diaminodiphenylmethane (DDM) and meta-phenylene diamine (mPDA). The use of different curing agents resulted in different glass-transition properties for the microwave curing of the three epoxy-amine systems. Whilst all three systems exibited a shorter curing time to reach the maximum percentage cure and T-g, the actual maximum values achieved for both percentage cure and T-g were significantly lower than for thermal curing. Evidently, during microwave curing, whilst a faster rate was obtained, the existence of the highly electron-attracting SO2 functional group appeared to induce a delay in the reactivity of the amine functions sufficient to entrap them in the crosslink network, effectively inhibiting further curing. In contrast, both the DDM and the mPDA systems, having different electron-donating fuctional groups, were able to achieve maximum percentage cure and T-g values equal to those for thermal curing, at significantly shorter curing times, due principally to a greater reduction in the effective cure time than in the lag time. Microwave curing seemed to be snore effective in reducing the overall cure time for the mPDA system. (C) 2001 Elsevier Science Ltd. All rights reserved. [References: 27]
机译:微电子工业中对工业应用的需求不断增长,导致需要加速固化环氧树脂等高性能结构胶粘剂系统。这种热固性体系的固化已成为整个生产过程的瓶颈。近来,已经证明微波固化作为加速固化系统是可行的替代方法。本文研究了在环氧体系的微波固化中使用不同的固化剂对最终固化的玻璃化转变温度(T-g)的影响。在双酚A的二缩水甘油醚(DGEBA)上进行微波辐射和热加热。所使用的三种固化剂是4,4'-二氨基二苯砜(DDS),4,4'-二氨基二苯甲烷(DDM)和间亚苯基二胺(mPDA)。对于三种环氧-胺体系的微波固化,使用不同的固化剂会导致不同的玻璃化转变性能。尽管所有三个系统都缩短了固化时间,以达到最大的固化百分率和T-g,但固化百分率和T-g的实际最大值均显着低于热固化。显然,在微波固化过程中,虽然获得了更快的速率,但高吸电子SO2官能团的存在似乎导致了胺官能团反应性的延迟,足以将其截留在交联网络中,有效地抑制了进一步的固化。相反,具有不同供电子功能基团的DDM和mPDA系统都能够在明显更短的固化时间下实现最大的固化百分率和Tg值与热固化相等,这主要是由于大大降低了固化时间。有效的固化时间要比滞后时间长。微波固化似乎在减少mPDA系统的总固化时间方面很有效。 (C)2001 Elsevier ScienceLtd。保留所有权利。 [参考:27]

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