The use of industrial oligomers modified by diisocyanates as adhesive and sealing compositions of different purposes

摘要

Methods for effective substitution of the traditional polymer-composite materials (PCM) during mounting of an electronic device by new-generation PCMs, including ones based on epoxyurethane oligomers (EPUR oligomers), are suggested. The processes of production of a complex of EPUR oligomer properties and polymers based on them are investigated.