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Preparation and surface characteristics of low-temperature curing fluorinated cathodic electrodeposition coating

机译:低温固化氟化阴极电沉积涂料的制备及表面特性

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摘要

Fluorinated cationic cathodic electrodepositing (CED) resins were synthesized by copolymerization of several acrylic monomers including Zonyl. Water dispersible cationic blocked-diisocyanate (denoted as TId) was also synthesized from isophorone diisocyanate (IPDI), cationic triethanolamine (TEOA), and dimethylpyrazole as the cross-linker for the low temperature curing at 90-120 degrees C. The emulsion stability of the cationic fluorinated CED resin was improved by ionization of the cross-linker TId, showing a mean particle diameter of 140-150 nm and a narrow distribution. 0.5 wt% of curing catalyst dibutyltin dilaurate (DBTL) was enough to accelerate the curing reaction and the gel content of the TId cured fluorinated CED film was higher than 90 wt% after being cured at 130 degrees C for 40 min. The contact angle and XPS spectrum of the CED film demonstrated that the surface enrichment of C-F-2 and C-F-3 groups effectively reduced the surface tension of the fluorinated CED coating and its surface tension gamma(sv) is even lower than 15 mN m(-1) for PTFE. The preheating of the CED film above T-g but below curing temperature promoted this surface enrichment of the fluorinated groups. Thermal fragmentation of the fluorinated side chains in the CED resins was successfully avoided due to using TId for low temperature curing. (c) 2007 Elsevier B.V. All rights reserved.
机译:氟化阳离子阴极电沉积(CED)树脂是通过包括Zonyl在内的几种丙烯酸单体共聚而合成的。还由异佛尔酮二异氰酸酯(IPDI),阳离子三乙醇胺(TEOA)和二甲基吡唑作为交联剂合成了水分散性阳离子封端的二异氰酸酯(表示为TId),用于90-120℃的低温固化。阳离子氟化CED树脂通过交联剂TId的电离得到改善,显示出140-150 nm的平均粒径和狭窄的分布。 0.5重量%的固化催化剂二月桂酸二丁基锡(DBTL)足以加速固化反应,并且在130℃下固化40分钟后,TId固化的氟化CED膜的凝胶含量高于90重量%。 CED膜的接触角和XPS光谱表明,CF-2和CF-3基团的表面富集有效降低了氟化CED涂层的表面张力,其表面张力gamma(sv)甚至低于15 mN m( -1)用于PTFE。 CED膜在T-g以上但在固化温度以下的预热促进了氟化基团的这种表面富集。由于使用TId进行低温固化,成功避免了CED树脂中氟化侧链的热断裂。 (c)2007 Elsevier B.V.保留所有权利。

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