首页> 外文期刊>Proceedings of the Royal Society. Mathematical, physical and engineering sciences >Observations of nanoindents via cross-sectional transmission electron microscopy: a survey of deformation mechanisms
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Observations of nanoindents via cross-sectional transmission electron microscopy: a survey of deformation mechanisms

机译:通过横截面透射电子显微镜观察纳米压痕:变形机制的调查

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Examination of cross-sections of nanoindents with the transmission electron microscope has recently become feasible owing to the development of focused ion beam milling of site-specific electron transparent foils. Here, we discuss the development of this technique for the examination of nanoindents and survey the deformation behaviour in a range of single crystal materials with differing resistances to dislocation flow. The principal deformation modes we discuss, in addition to dislocation flow, are phase transformation (silicon and germanium), twinning (gallium arsenide and germanium at 400 degrees C), lattice rotations (spinel), shear (spinel), lattice rotations (copper) and lattice rotations and densification (TiN/NbN multilayers). The magnitude of the lattice rotation, about the normal to the foil, was measured at different positions under the indents. Indents in a partially recrystallized metallic glass Mg66Ni20Nd14 were also examined. In this case a low-density porous region was formed at the indent tip and evidence of shear bands was also found. Further understanding of indentation deformation will be possible with three-dimensional characterization coupled with modelling which takes account of the variety of competing deformation mechanisms that can occur in addition to dislocation glide. Mapping the lattice rotations will be a particularly useful way to evaluate models of the deformation process.
机译:由于聚焦特定的电子透明箔的离子束铣削的发展,用透射电子显微镜检查纳米压痕的横截面最近变得可行。在这里,我们讨论了用于检查纳米压痕的这项技术的发展,并调查了对位错流动具有不同阻力的一系列单晶材料的变形行为。除了位错流,我们讨论的主要变形模式是相变(硅和锗),孪晶(砷化镓和锗在400摄氏度下),晶格旋转(尖晶石),剪切(尖晶石),晶格旋转(铜)。晶格旋转和致密化(TiN / NbN多层膜)。在凹痕下的不同位置测量了围绕箔法线的晶格旋转的大小。还检查了部分重结晶的金属玻璃Mg66Ni20Nd14中的压痕。在这种情况下,在压痕尖端处形成了一个低密度的多孔区域,并且还发现了剪切带。压痕变形的进一步理解将可能通过三维特征与建模相结合来实现,该建模考虑了位错滑移之外可能发生的各种竞争性变形机制。映射晶格旋转将是评估变形过程模型的一种特别有用的方法。

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