Electrodeposition, growth morphology & melting characteristics of gold-tin eutectic alloys

摘要

Eutectic Au-Sn (80/20 percent by weight) solders have good electrical and heat conducting properties, as well as superior thermal fatigue strength as compared to other material used in microelectronics assembly, such as SnPb-solders and conducting epoxies. A chemistry has been developed to electroplate high quality Au-Sn deposits and to characterize the coatings in terms of alloy and phase composition, structure, and melting characteristics. An operating window and the long-term stability of theplating process have been established.