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首页> 外文期刊>Polyhedron: The International Journal for Inorganic and Organometallic Chemistry >N-heterocyclic carbene-silver complexes: Potential conductive materials for silver pastes in electronic applications
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N-heterocyclic carbene-silver complexes: Potential conductive materials for silver pastes in electronic applications

机译:N-杂环卡宾-银配合物:电子应用中银浆的潜在导电材料

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摘要

New organosilver complexes, silver(I) tetraalkylbis(benzimidazolidene) halide [1a-3a] and silver(I) dimethyl-N,N′-hexyl(imidazolyl) bromide [4a], were synthesized and incorporated into electroconductive silver pastes. Complex 3a had a 15-fold higher conductivity than conventional silver salt pastes, specifically silver(I) hexanoate, and exhibited a smooth, homogeneous surface after reductive heat-treatment of the silver paste. While the conductivity of silver(I) hexanoate can be increased by up to 33% by the addition of a supporting silver source, such as Ag2O, the conductivity of 3a was markedly decreased by Ag2O treatment. Thus, 3a can be used in silver pastes with moderate conductivity and can reduce the amount of conventional silver supporting materials without loss of electroconductivity.
机译:合成了新的有机银配合物,即四烷基双(苯并咪唑啉)卤化银(I)和1(甲基)二甲基-N,N'-己基(咪唑基)溴化银[4a],并将其掺入导电银浆中。配合物3a的电导率比常规的银盐糊剂,特别是己酸银(I)糊剂高15倍,并且在还原性热处理后显示出光滑,均匀的表面。通过添加支持性银源(例如Ag2O),可将己酸银(I)的电导率提高多达33%,但通过Ag2O处理,3a的电导率显着降低。因此,3a可以用于具有适度导电性的银浆中,并且可以在不损失导电性的情况下减少常规银支撑材料的量。

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