...
首页> 外文期刊>Polimery >Kinetics of the curing reaction of selected epoxy resin-amine systems
【24h】

Kinetics of the curing reaction of selected epoxy resin-amine systems

机译:选定的环氧树脂-胺体系的固化反应动力学

获取原文
获取原文并翻译 | 示例
           

摘要

The paper is a review of authors' research works on curing reaction of some commercial and synthesized by them epoxy resins (among others - with liquid crystalline fragments).As curing agents 5 aromatic diamines differing in chemical structure were used.The results of investigation of curing kinetics by differential scanning calorimetry (DSC) confirm the significant effect of heating rate (up to 20 deg C/min) on the process.It was found,for example,that for small heating rate (2-5 deg C/min) DSC thermograms of epoxy resins with liquid crystalline fragments show double exothermic peak contrary to the thermograms of typical epoxy resins showing single exothermic peaks.This phenomenon is attributed to the formation of smectic structure during the curing (at temp.132-162 deg C).Usefulness of three various kinetic models (by Barret,Borchardt-Daniels or Kissinger) describing the curing process investigated have been compared.
机译:本文是作者对一些商用固化反应研究的综述,其中包括环氧树脂(包括液晶片段)与环氧树脂的合成。作为固化剂,使用了5种化学结构不同的芳族二胺。差示扫描量热法(DSC)的固化动力学证实了加热速率(最高20摄氏度/分钟)对该工艺有显着影响,例如,发现加热速率较小(2-5摄氏度/分钟)时带有液晶碎片的环氧树脂的DSC热谱图显示出双放热峰,而典型的环氧树脂的DSC热谱图显示出单个放热峰,此现象归因于固化过程中(温度132-162摄氏度)近晶结构的形成。比较了描述所研究的固化过程的三种动力学模型(由Barret,Borchardt-Daniels或Kissinger提出)的有用性。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号