The Curing Reaction Kinetics Of Epoxy/anhydride/silica Systems

摘要

Advances in the electricity industry have led to increasing demands for epoxy/anhydride/silica insulation systems. In this present study, the curing reaction kinetics of two epoxy systems are investigated using non-isothermal differential scanning calorimetry (DSC). Their mixtures were isothermally cured under vacuum at 130 ℃ for differing lengths of time, and their glass transition temperatures, T_g, activation energies, E_A, and other parameters were determined by DSC. Interest in such systems centres on their industrial applications, for which reason it was decided to study high silica loadings, cured at 130℃; a curing temperature that was shown to be the most appropriate for these systems in all cases, as it prevented cracks and structural defects in the moulding production processes.