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Electronic transport and localization in nitrogen-doped graphene devices using hyperthermal ion implantation

机译:使用高温离子注入的氮掺杂石墨烯器件中的电子传输和定位

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Hyperthermal ion implantation offers a controllable method of producing high-quality substitutionally doped graphene with nitrogen, an n-type dopant that has great potential for graphene electronics and spintronics applications where high carrier concentration, uniform doping, and minimal vacancy defect concentration is desired. Here we examine the transport properties of monolayer graphene sheets as a function of implantation beam energy and dose. We observe a transition from weak to strong localization that varies as a function of carrier concentration. For nominally equivalent doses, increased N ion energy results in an increasing magnetoresistance magnitude, reaching a value of approximately -5.5% at 5000 Oe, which we discuss in the context of dopant concentration and defect formation. We use a model for the temperature dependence of the conductivity that takes into account both temperature activation, due to the formation of a transport gap, and Mott variable-range hopping, due to the formation of defects, to further study the electronic properties of the doped films as a function of dose and N ion energy. We find that the temperature activation component dominates the behavior.
机译:高温离子注入提供了一种可控的方法来生产高质量的氮掺杂掺杂石墨烯,这种n型掺杂剂对于需要高载流子浓度,均匀掺杂和最小空位缺陷浓度的石墨烯电子学和自旋电子学应用具有巨大潜力。在这里,我们检查了单层石墨烯片的传输性能,作为注入束能量和剂量的函数。我们观察到从弱到强定位的转变,其随载流子浓度的变化而变化。对于名义上相等的剂量,增加的N离子能量会导致磁阻强度增加,在5000 Oe时达到约-5.5%的值,我们将在掺杂剂浓度和缺陷形成的背景下进行讨论。我们使用电导率的温度依赖性模型,该模型同时考虑了由于形成传输间隙而引起的温度激活和由于形成缺陷而引起的Mott可变范围跳跃,从而进一步研究了电导率的电子性质。掺杂膜的剂量和氮离子能量的函数。我们发现温度激活组件主导了行为。

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