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Unsteady contact melting of a rectangular cross-section material on a flat plate

机译:矩形截面材料在平板上的不稳定接触熔化

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The work in this paper concerns a mathematical model of the contact melting process of a rectangular material in contact with a hot plate. The problem is described by a coupled system of heat equations in the solid and melt layer, fluid flow in the melt, a Stefan condition at the melt interface, and a force balance between the weight of the solid and the fluid pressure. Since the melt layer remains thin throughout the process, we use the lubrication approximation to the fluid equations and assume that the heat flow in the fluid is dominated by conduction across the thin film. In the solid we employ a heat balance integral method. Results show that the film height has initial and final rapid increases, whereas for intermediate times the height slowly increases. The quasisteady state of previous models is never attained: This is shown to be an effect of neglecting the change in mass and conduction in the solid. The previously observed initial infinite velocity of the melt is shown to be a result of the perfect thermal contact assumption. For a water-ice system the melting rate is shown to be approximately linear, this allows us to reduce the problem to solving a single first order differential equation for the liquid layer thickness. The main analysis is carried out in two dimensions, but we briefly highlight the extension to three dimensions. The method is verified by comparison with previously published experimental results on the melting of n-octadecane. (C) 2008 American Institute of Physics. [DOI: 10.1063/1.2990751]
机译:本文的工作涉及与热板接触的矩形材料的接触熔化过程的数学模型。该问题由固体和熔体层中的热方程式耦合系统,熔体中的流体流动,熔体界面处的Stefan条件以及固体重量和流体压力之间的力平衡来描述。由于熔体层在整个过程中保持较薄,因此我们对流体方程使用润滑近似方法,并假设流体中的热流由薄膜上的传导控制。在固体中,我们采用热平衡积分法。结果表明,膜的高度具有初始和最终的快速增加,而在中间时间,膜的高度缓慢增加。从来没有达到以前模型的准稳态:这表明​​是忽略了固体中质量和电导率变化的影响。先前观察到的熔体的初始无限速度显示为理想的热接触假设的结果。对于水冰系统,熔化速率显示为近似线性,这使我们可以减少求解液体层厚度的单个一阶微分方程的问题。主要分析是在两个维度上进行的,但我们简要强调了对三个维度的扩展。通过与先前发表的正十八烷熔融实验结果进行比较,验证了该方法。 (C)2008美国物理研究所。 [DOI:10.1063 / 1.2990751]

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