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首页> 外文期刊>Advances in materials science and engineering >How Slight Solidification Rate Variations within Cast Plate Affect Mechanical Response: A Study on As-Cast A356 Alloy with Cu Additions
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How Slight Solidification Rate Variations within Cast Plate Affect Mechanical Response: A Study on As-Cast A356 Alloy with Cu Additions

机译:铸板内部轻微凝固速率的变化如何影响机械响应:含Cu的铸态A356合金的研究

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The present work investigates a narrow range of secondary dendrite arm spacing (SDAS), in an as-cast A356 alloy with and without copper (Cu) additions. Cu was added to the base A356 alloy melt to reach the target concentration of 0.5 and 1 wt.%. Samples were selected from 3 different positions within the cast plate, offering 30, 35, and 40 μm SDAS variants. Tensile curves revealed a strong influence between the specimen cutting position and strength, with a pronounced effect in the Cu-containing alloys. Hardness measurements did not confirm the tensile response; hence, to understand the phenomenon, microstructural features have been investigated in detail. Eutectic silicon (Si) particle equivalent diameter (ED) size decreased from the top (T) to the bottom (B) position of the cast. Eutectic Si particle surface area (A%) was found to be denser at the B as compared to the T and simultaneously in the Cu-containing alloy as compared to the Cu-free reference alloy. Backscattered electron (BSE) images were employed to investigate the nature of the Cu-rich intermetallic phases. In conclusion, electrical conductivity measurements were performed to confirm the trends observed.
机译:本工作研究了铸态A356合金中添加和不添加铜(Cu)时窄范围的二次枝晶臂间距(SDAS)。将铜添加到基础A356合金熔体中,以达到目标浓度0.5和1 wt。%。从铸板上的3个不同位置选择样品,提供30、35和40μm的SDAS变体。拉伸曲线揭示了试样切割位置和强度之间的强烈影响,在含铜合金中效果显着。硬度测量不能确定拉伸响应。因此,为了理解该现象,已经对微观结构特征进行了详细研究。共晶硅(Si)的当量直径(ED)尺寸从铸件的顶部(T)到底部(B)减小。发现与B相比,B处的共晶Si颗粒表面积(A%)更致密,同时与不含Cu的参考合金相比,含Cu合金中的共晶Si颗粒表面积(A%)更致密。背散射电子(BSE)图像用于研究富铜金属间相的性质。总之,进行电导率测量以确认观察到的趋势。

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