机译:Effects of N{sub}2 plasma treatment of titanium nitride/borophosphosilicate glass patterned substrates on metal organic chemical vapor deposition of copper
机译:(hfac)Cu(I)(MP) (hfac=hexafluoroacetylacetonate, MP=4-methyl-1-pentene) and (hfac)Cu(I)(DMB) (DMB=3.3-dimethyl-1-butene) for the chemical vapor deposition of copper films
机译:a-SiC{sub}x:H films deposited by plasma-enhanced chemical vapor deposition at low temperature used for moisture and corrosion resistant applications