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SPIE Conference on Design for Manufacturability Through Design-process Integration

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1.Contour-based Optical Proximity Correction

机译：基于轮廓的光学邻近校正
- 作者：Brian Zhou;Liang Zhu;Yingchun Zhang;Yili Gu;Xiaohui Kang
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- Resolution Enhancement Technologies;
- Optical Proximity Correction;
- Edge Placement Error;
- OPCIter;
- Dense Simulation;
2.Model-Based adaptive Fragmentation

机译：基于模型的自适应碎片
- 作者：Daisy Liu;Cheng He Li;Xiao Hui Kang
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- Edge Placement Error;
- Model-based Fragmentation;
- Optical Proximity Correction;
- Grid-based Simulation;
3.Process Variability Band Analysis for QuantitativeOptimization of Exposure Conditions

机译：用于定量优化暴露条件的过程变化带分析
- 作者：John L. Sturtevant;Srividya Jayaram;Le Hong
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- SMO;
- Illumination;
- NA;
- sigma;
- Post-OPC Verification;
- simulation;
- PV Band;
4.The PIXBAR OPC for Contact-Hole Pattern in sub-70-nm Generation

机译：SUB-70-NM生成中的接触孔模式的PIXBAR OPC
- 作者：KunYuan Chen;ChunCheng Liao;ShuHao Chen;Todd Wey;Phoeby Cheng;Pinjan (Ryan) Chou;Jochen Schacht;Dyiann Chou;Srividya Jayaram
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- PIXBAR;
- OPC;
- Pix-based;
- Contact-Hole;
- Assist-Feature;
- Process Window;
5.Score-Based Fixing Guidance GenerationWith Accurate Hot-Spot Detection Method

机译：基于分数的定影引导生成准确的热点检测方法
- 作者：Yong-Hee Park;Dong-Hyun Kim;Jung-Hoe Choi;Ji-Suk Hong;Chul-Hong Park;Sang-Hoon Lee;Moon-Hyun Yoo;Jun-Dong Cho
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- hot-spot detection;
- calibrated scoring function;
- layout fixing guidance;
- process window;
6.Transistor Layout Configuration Effect on Actual Gate LER

机译：实际门槛上的晶体管布局配置效果
- 作者：Guy Ayal;Eitan Shauly;Israel Rotshtein;Ovadya Menadeva;Amit Siany;Ram Peltinov;Yosi Shacham-Diamand
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- Configuration;
- LWR;
- DFM;
7.Layout Electrical cooptimizationfor increased tolerance to process variations

机译：为处理变化的容差增加，布局电气协调
- 作者：Lionel Riviere-Cazaux;Philippe Hurat;Bala Kasthuri;Larry Layton;Nishath Verghese;Cadence Design
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- DFM;
- Design for manufacturing;
- yield;
- variability;
- standard cells;
- lithography variability;
- shaped gate;
8.Statistical approach to design DRAM bitcell considering overlay errors

机译：考虑覆盖错误设计DRAM位单元的统计方法
- 作者：Yu-Jin Pyo;Dae-Wook Kim;Jai-Kyun Park;Ji-Seong Doh;Hyun-Jae Kang;Ji-Suk Hong;Chul-Hong Park;Sang-Hoon Lee;Moon-Hyun Yoo
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- Overlay specification;
- Monte Carlo simulation;
- DRAM bitcell;
- systematic yield;
- parametric yield;
9.Circuit-topology driven OPC for increasedperformance/yield ratio

机译：电路拓扑驱动OPC，用于升级/屈服比
- 作者：Edmund Pierzchala;Fedor Pikus;J. Andres Torres
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- DFM;
- yield;
- performance;
- digital circuits;
- nanometer design;
10.Large-scale double-patterning compliant layouts for DP engineand design rule development

机译：DP Engineand设计规则开发的大规模双图案兼容布局
- 作者：Christopher Cork;Kevin Lucas;John Hapli;Herve Raffard;Levi Barnes
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- development;
- applicability;
- distribution;
11.Practical implementation of via and wire optimization at the SoC level

机译：SOC水平的VIA和WIRE优化的实际实施
- 作者：Chi-Min Yuan;Guy Assad;Bob Jarvis;Marc Olivares;Lionel Riviere Cazeau;Puneet Sharma;Jayathi Subramanian;Matt Thompson;Kevin Wu
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- Redundant vias;
- via doubling;
- twin vias;
- wire spreading;
- wire widening;
- litho hotspot;
- critical area analysis;
- design for manufacturing;
12.Manufacturing system based on tolerance deduced from designintention

机译：基于专业化的公差制造系统
- 作者：Suigen Kyoh;Shimon Maeda;Sachiko Kobayashi;Soichi Inoue
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- DFM;
- design intention;
- tolerance;
- process budget;
13.Timing-Aware Metal Fill For Optimized Timing Impact and Uniformity

机译：定时感知金属填充优化的时序冲击和均匀性
- 作者：Usha Katakamsetty;Colin Hui;Li-Da Huang;Lannie Weng;Peter Wu
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- Chemical Mechanical Polishing (CMP);
- timing-aware track fill;
- place and route;
14.Verification of extraction repeating pattern efficiencyfrom many actual device data

机译：从许多实际设备数据验证提取重复模式效率
- 作者：Masahiro Shoji;Tadao Inoue;Masaki YamabeMask
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- DFM;
- OPC;
- mask writing;
- character projection;
15.Uniformity-Aware Standard Cell Design with Accurate ShapeControl

机译：具有精确的ShapeControl的均匀性感知标准单元设计
- 作者：Hongbo Zhang;Martin D.F. Wong;Kai-Yuan Chao;Liang Deng;Soo-Han Choi
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- Standard Cell Design;
- 1-D patterning;
- Gap Distribution;
- Dense Line Printing;
- Double Patterning;
16.Simplify to Survive,prescriptive layouts ensure profitable scaling to 32nm and beyond

机译：简化以生存，规定的布局确保盈利缩放到32nm及以后
- 作者：Lars Liebmann;Larry Pileggi;Jason Hibbeler;Vyacheslav Rovner;Tejas Jhaveri;Greg Northrop
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
17.Enhanced Layout Optimization of Sub-45nm Standard, Memory Cells and Its Effects

机译：增强了Sub-45nm标准，内存单元及其效果的布局优化
- 作者：Seung Weon Paek;Dae Hyun Jang;Joo Hyun Park;Naya Ha;Byung-Moo Kim;Hyo Sig Won;Kyu-Myung Choi;Kuang-Kuo Lin;Simon Klaver;Shobhit Malik;Michiel Oostindie;Frank Driessen
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- DfM kit(s);
- DfM validation;
- Trade-off;
- CAA;
- Recommended rule;
- litho;
- primitive cell(s);
- leaf-cell(s);
- Memory compilers;
18.Lithography Aware Statistical Context Characterization of 40nmLogic Cells

机译：光刻意识到40nmlogic细胞的统计背景表征
- 作者：Mark E. Rubin;Naohiro Kobayashi;Toshiaki Yanagihara
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- lithographic;
- Statistical;
- CMOS;
19.Full-flow for transistors simulation based on edge-contour extraction and Advanced SPICE simulation

机译：基于边缘轮廓提取和高级香料仿真的晶体管仿真全流
- 作者：Eitan Shauly;Andres Torres;Loran Friedrich;Moran Cohen-Yasour;Ovadya Menadeva;Fedor Pikus
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- ECE;
- MOSFET;
- simulation;
20.Modeling and simulation of transistor performance shift underpattern-dependent RTA process

机译：晶体管性能变化的建模与仿真在底层替补的RTA过程中
- 作者：Yun Ye;Frank Liu;Yu Cao
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- Rapid-Thermal Annealing;
- Layout Pattern;
- Dopant Activation;
- Threshold Voltage Variation;
- Physical Design;
21.High-precision contouring from SEM image in 32-nm lithography andbeyond

机译：从SEM图像中的32-NM光刻＆Beyond的高精度轮廓
- 作者：Hiroyuki Shindo;Akiyuki Sugiyama;Hitoshi Komuro;Yutaka Hojyo;Ryoichi Matsuoka;John L. Sturtevant;Thuy Do;Ir Kusnadi;Germain Fenger;Peter De Bisschop;Jeroen Van de Kerkhove
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- OPC;
- CD-SEM;
- SEM contouring;
- model calibration;
- MBAC (Measurement Based Averaged Contour) contour-based model calibration;
22.Variability aware interconnect timing models for double patterning

机译：可变性识别的双图案化的互连定时模型
- 作者：Eric Y. Chin;Andrew R. Neureuther
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- interconnect;
- defocus;
- dose;
- overlay;
- extraction;
- timing;
- DFM;
- double patterning;
23.Detecting Context Sensitive Hot Spots in Standard Cell Libraries

机译：检测标准单元库中的上下文敏感热点
- 作者：Jen-Yi Wuu;Fedor G. Pikus;Andres Torres;Malgorzata Marek-Sadowska
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- DFM;
- manufacturability;
- lithography;
- hot spot detection;
- layout optimization;
- standard cell library;
24.The Nebulous Hotspot and Algorithm Variability

机译：模糊的热点和算法变异性
- 作者：Alfred K. K. Wong;Edmund Y. Lam
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- algorithm variability;
- computation lithography;
- LPC;
- hotspot;
25.Directional 2D functions as models for fast layout pattern transferverification

机译：定向2D用作快速布局图案传送验证的模型
- 作者：J. Andres Tones;Mark Hofmann;Oberdan Otto
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- DFM;
- Lithography checks;
- layout verification;
- layout portability;
26.Computational Requirements for OPC

机译：OPC的计算要求
- 作者：Chris Spence;Scott Goad
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
27.2D Design Rule and Layout Analysis using Novel Large-areaFirst-principles-based Simulation Flow IncorporatingLithographic and Stress Effects

机译：使用基于大面积的大面积大小原则的模拟流程的2D设计规则和布局分析掺入了光谱和应力效应
- 作者：Steven L. Prins;James Blatchford;Oluwamuyiwa Olubuyide;Deborah Riley;Simon Chang;Qi-Zhong Hong;T.S. Kim;Ricardo Borges;Li Lin
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- Stress Variability;
- Design Rules;
- Mobility;
- Random Context;
28.Electrical Impact of Line-Edge Roughness on Sub-45nm NodeStandard Cell

机译：线边缘粗糙度对45nm NodeStandard细胞的电气冲击
- 作者：Yongchan Ban;Savithri Sundareswaran;Rajendran Panda;David Z. Pan
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- LER;
- line-edge roughness;
- sub-45nm process;
- standard cell;
- circuit performance;
- DFM;
29.Parameter-Specific Electronic Measurement and Analysis of Sourcesof Variation using Ring Oscillators

机译：使用环形振荡器的参数特定的电子测量和分析变化源
- 作者：Lynn T.-N. Wang;Liang-Teck Pang;Andrew R. Neureuther;Borivoje Nikolic
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- Variability;
- ring oscillators;
- lithography;
- DFM;
- Pattern Matching;
- focus;
- misalignment;
- stress;
30.Interval-value Based Circuit Simulation for Statistical Circuit Design

机译：基于区间值的统计电路设计电路仿真
- 作者：Qian Ying Tang;Costas J. Spanos
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- interval-valued circuit simulation;
- statistical design;
- variability;
31.Variations in timing and leakage power of 45nm library cells due tolithography and stress effects

机译：45nm库电池的定时和泄漏功率变化到期水平和应力效应
- 作者：Kayvan Sadra;Mark Terry;Arjun Rajagopal;Robert A. Soper;Donald Kolarik;Tom Aton;Brian Hornung;Rajesh Khamankar;Philippe Hurat;Bala Kasthuri;Yajun Ran;Nishath Verghese
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- variations;
- timing;
- leakage power;
- library;
- DFM;
- LEA;
- context dependence;
- stress;
32.Source-mask selection using computational lithography incorporatingphysical resist models

机译：使用计算光刻的源掩码选择包含本体抗蚀剂模型
- 作者：Sanjay Kapasi;Stewart Robertson;John Biafore;Mark D. Smith
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- Computational lithography;
- Resist models;
- Source-Mask;
- PROLITH;
- LithoWare;
- Simulation;
- SMO;
- Rigorous models;
- Physical models;
- Virtual lithography;
33.Hotspot Management for Spacer Patterning Technologywith Die-to-Database Wafer Inspection System

机译：适用于钻孔图案化技术的热点管理，钻到数据库晶圆检测系统
- 作者：Yoshinori Hagio;Ichirota Nagahama;Yasuo Matsuoka;Hidefumi Mukai;Kohji Hashimoto
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- Spacer patterning process;
- Die-to-database inspection;
- Hotspot management;
- DFM;
34.Design-Overlay Interactions in Metal Double Patterning

机译：金属双图案化的设计叠加相互作用
- 作者：Rani S. Ghaida;Puneet Gupta
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- Double patterning;
- overlay;
- overlay control;
- alignment strategy;
- overlay budget;
- DFM;
- wire spreading;
- wire widening;
- congestion;
35.Convergent Automated Chip Level LithographyChecking and Fixing at 45nm

机译：收敛自动化芯片水平光刻刻录和固定在45nm
- 作者：Valerio Perez;Shyue Fong Quek;Sky Yeo;Colin Hui;Kuang Kuo Lin;Walter Ng;Michel Cote;Bala Kasthuri;Philippe Hurat;Matt A. Thompson;Chi-Min Yuan;Puneet Sharma
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- Automated;
- OPC;
- LPA;
36.Illustration of Illumination Effects on Proximity, Focus Spillover, andDesign Rules

机译：照明效应的插图在接近，聚焦溢出，anddesign规则
- 作者：Lynn T.-N. Wang;Anthony Yeh;Lilly Kem;Andrew R. Neureuther
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- Pattern matching;
- annular illumination;
- dipole illumination;
- off-axis;
- defects;
- ATT-PSM;
- focus;
- 45nm technology;
37.Computational technology scaling from 32 nm to 28 and 22 nmthrough systematic layout printability verification

机译：计算技术从32nm到28和22纳米下来的系统布局可打印验证
- 作者：Jason P. Cain;Luigi Capodieci
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- design for manufacturability;
- computational scaling;
- lithographic printability;
- process capability;
38.Systematic study of the impact of curved active and poly contourson transistor performance

机译：弯曲有效和聚扶晶体管性能影响的系统研究
- 作者：Victor Moroz;Munkang Choi;Xi-Wei Lin
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
39.Process Variation Aware OPC Modeling for Leading EdgeTechnology Nodes

机译：用于领先的Edjetechnology节点的过程变型感知OPC建模
- 作者：Qiaolin(Charlie) Zhang;Ebo Croffie;Yongfa Fan;Jianliang Li;Kevin Lucas;Brad Falch;Lawrence Melvin
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
40.Compensating Non-Optical Effects using Electrically-Driven OpticalProximity Correction

机译：使用电驱动的光学突变校正来补偿非光学效应
- 作者：Shayak Banerjee;Kanak B. Agarwal;James A. Culp;Praveen Elakkumanan;Lars W.Liebmann;Michael Orshansky
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- Electrically-driven OPC;
- design intent;
- systematic variation;
- compensation of variability;
41.Developing DRC Plus Rules through 2D Pattern Extraction andClustering Techniques

机译：通过2D模式提取和集集技术开发DRC Plus规则
- 作者：Vito Dai;Luigi Capodieci;Jie Yang;Norma Rodriguez
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- design;
- rule;
- pattern;
- classify;
- hotspot;
- manufacturability;
- style;
- variability;
42.Design Ranking and Analysis Methodology for StandardCells and Full Chip Physical Optimization

机译：设计排名和分析方法，用于标准化单元和全芯片物理优化
- 作者：Yosi Vaserman;Eitan Shauly
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- DFM;
- DFM metrics;
- design ranking;
- yield scoring;
43.Test Structures for 40 nm Design Rule Evaluation

机译：测试结构40 nm设计规则评估
- 作者：Jonathan Ho;Yan Wang;Benjamin Lin
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- Design for manufacturability (DFM);
- Lithography;
44.Clustering and pattern matching for an automatichotspot classification and detection system

机译：用于自动机密分类和检测系统的聚类和模式匹配
- 作者：Justin Ghan;Ning Ma;Sandipan Mishra;Costas Spanos;Kameshwar Poolla;Norma Rodriguez;Luigi Capodieci
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- hotspot classification;
- DRC;
- pattern-matching;
- incremental clustering;
45.Exploration of Complex Metal 2D Design Rules Using InverseLithography

机译：思考法探索复杂金属2D设计规则
- 作者：Simon Chang;James Blatchford;Steve Prins;Scott Jessen;Thuc Dam;Guangming Xiao;Linyong Pang;Bob Gleason
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- Design rule;
- OPC;
- lithography simulation;
- metal patterning;
46.Implementing a Framework to Generate a Unified OPC database fromdifferent EDA Vendors for 45nm and beyond

机译：实现框架以生成统一的OPC数据库，从Different EDA供应商处为45nm及更高
- 作者：Shady Abdel Wahed;Mohamed Al-Imam;Rami Fathy;Nader Hindawy;Jochen Schacht;Regina Shen;Chia Wei Huang;Pei Ru Tsai;Te Hung Wu;Chuen Huei Yang
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- Lithography Modeling;
- Model Based OPC;
- OPC Fragmentation;
47.Implementing Self-Aligned Double Patterning onNon-Gridded Design Layouts

机译：实施自我对齐的双图案onnon-gridded设计布局
- 作者：Huixiong Dai;Jason Sweis;Chris Bencher;Yongmei Chen;Jen Shu;Xumon Xu;Chris Ngai;Judy Huckabay;Milind Weling
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- Sidewall spacer;
- double patterning;
- self-aligned;
- layout decomposition;
- SSDP;
- SADP;
48.Application of Pixel-based Mask Optimization Technique for HighTransmission Attenuated PSM

机译：基于像素的掩模优化技术在高旋转衰减PSM中的应用
- 作者：Kyohei Sakajiri;Alexander Tritchkov;Yuri Granik;Eric Hendrickx;Geert Vandenberghe;Monica Kempsell;Germain Fenger;Klaus Boehm;Thomas Scheruebl
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- inverse lithography;
- sub-resolution assist features;
- high transmission attenuated PSM;
- MRC;
49.Hierarchical Modeling of Spatial Variability with a 45nm Example

机译：45nm示例的空间变异性的层次建模
- 作者：Kun Qian;Borivoje Nikolie;Costas J. Spanos
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- circuit variability;
- across-wafer variation;
- 45nm;
- ring oscillator;
- pattern dependent effect;
50.Hotspot Detection and Design RecommendationUsing Silicon Calibrated CMP Model

机译：热点检测和设计推荐硅校准CMP模型
- 作者：Colin Hui;Wang Xian Bin;Haigou Huang;Ushasree Katakamsetty;Laertis Economikos;Mohammed Fayaz;Stephen Greco;Hua Xiang;Subramanian Jayathi;Yuan Chi-Min;Li Song;Vikas Mehrotra;Kuang Han Chen;Tamba Gbondo-Tugbawa;Taber Smith
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- Chemical Mechanical Polishing (CMP);
- Design for Manufacturability (DFM);
- Copper Puddling;
- Topography;
51.Design specific variation in pattern transfer by via/contact etchprocess: full-chip analysis

机译：通过通孔/触点蚀刻过程设计具体变化：全芯片分析
- 作者：Valeriy Sukharev;Ara Markosian;Armen Kteyan;Levon Manukyan;Nikolay Khachatryan;Jun-Ho Choy;Hasmik Lazaryan;Henrik Hovsepyan;Seiji Onoue;Takuo Kikuchi;Tetsuya Kamigaki
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- Plasma etch;
- microloading;
- pattern density;
- full—chip;
- simulation;
52.Tiny Footprint Programmable Electrical Defocus Monitors

机译：微小的足迹可编程电气defocus监视器
- 作者：Wojtek Poppe;Patrick Au;Darshana Jayasuriya;Juliet Rubinstein;Andrew R.Neureuther
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- Defocus;
- defocus monitor;
- electrical process monitor;
- process characterization;
- DFM;
53.Algorithm for determining printability and colouringof a target layout for double patterning

机译：用于确定双图案化目标布局的可印刷性和Colouring的算法
- 作者：Justin Ghan;Apo Sezginer
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- Double patterning;
- printability;
- decomposition;
- RET;
54.Integration of Mask and Silicon Metrology in DFM

机译：DFM中面具和硅计量的整合
- 作者：Ryoichi Matsuoka;Hiroaki Mito;Akiyuki Sugiyama;Yasutaka Toyoda
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- CD-SEM;
- OPC;
- Recipe generation;
- SEM image;
- CAD design layout;
- DFM;
- Contour;
- Hotspot;
55.Impact of Lithography Variability on Analog Circuit Behavior

机译：光刻变异性对模拟电路行为的影响
- 作者：Christopher Progler;Bhaskar Banerjee;M. F. Hanif;T. Mahzabeen
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2009年
- Variability;
- Behavior;
- fabrication;
56.A New Fast Resist Model: the Gaussian LPM

机译：一种新的快速抗蚀剂模型：高斯LPM
- 作者：Chris A. Mack
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- Lumped Parameter Model;
- LPM;
- full-chip simulation;
- compact resist model;
- optical proximity correction;
- OPC;
57.Rerouting and Guided Repair Strategies To Resolve Lithography Hotspots

机译：重新路由和引导修复策略来解决光刻热点
- 作者：Reinhard Marz;Kai Peter;Kay Engelhardt
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- design for manufacturing;
- lithography friendly design;
- re-routing;
- guided repair;
58.Using Templates and Connectors for Layout Pattern Minimization in 20nm and Below Technology Nodes

机译：使用模板和连接器在20nm和以下技术节点下方的布局模式最小化最小化
- 作者：Tejas K. Jhaveri;Andrzej J. Strojwas
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- Templates;
- Regular Design Fabric;
- Computational Lithography;
- DFM;
- SMO;
- DPT;
59.Statistical approach to specify DPT process in terms of patterning and electrical performance of sub-30nm DRAM device

机译：在Sub-30nm DRAM设备的图案化和电气性能方面指定DPT过程的统计方法
- 作者：Yu-Jin Pyo;Soo-Han Choi;Chul-Hong Park;Sang-Noon Lee;Moon-Hyun Yoo;Gyu-Tae Kim
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- double patterning;
- hotspot;
- electrical performance;
- process specification;
- DRAM;
60.Applications of DBV (Design Based Verification)for steep ramp- up Manufacture

机译：DBV（基于设计的验证）在陡峭斜坡制造中的应用
- 作者：Tae Heon Kim;Dae-Han Han;Yong-Hyeon Kim;Min-Chul Han;Hong-Ji Lee;Ae-Ran Hong;Yoon-Min Kim;In-Ho Nam;Yong-Jik Park;Kyung-Seok Oh
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- Design Based Verification;
- OPC;
- TAT;
- hotspot;
- post Verification;
- Hotspot Pattern Analyzer;
- NGR;
61.Lithography Aware Design Optimization using ILT

机译：光刻意识设计优化使用over
- 作者：Jaeyoon Jeong;Seokyun Jeong;Changhoon Ahn;Yonsun Jang;Sukjoo Lee;Thomas Cecil;Donghwan Son;Tatung Chow;David Kim
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- DFM;
- Design Optimization;
- Layout Optimization;
- ILT;
- OPC;
62.Standard Cell Electrical and Physical Variability Analysis based onAutomatic Physical Measurement for Design-for-Manufacturing Purposes

机译：基于标准的细胞电气和物理变异分析，基于仿制性的制造目的
- 作者：Eitan Shauly;Allon Parag;Hafez Khmaisy;Uri Krispil;Ofer Adan;Shimon Levi;Sergey Latinsky;Ishai Schwarzband;Israel Rotstein
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- Standard Cell Electrical;
- Physical Variability;
- Physical Measurement;
63.Fast Process-Hotspot Detection Using Compressed Patterns

机译：使用压缩模式进行快速处理 - 热点检测
- 作者：Peter Rezk;Wael ElManhawy
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- DFM;
- Lithography hotspots;
- layout verification;
- pattern compression;
64.In-Design DFM CMP Flow for Block Level Simulation Using 32nm CMP Model

机译：设计DFM CMP流量，用于使用32nm CMP模型进行块电平仿真
- 作者：Naya Ha;Jinwoo Lee;SW Paek;Kee Sup Kim;Kuang Han Chen;Aaron Gower-Hall;Tamba Gbondo-Tugbawa;Philippe Hurat
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
65.Extending analog design scaling to sub-wavelength lithography:co-optimization of RET and photomasks

机译：扩展模拟设计缩放到子波长光刻：RET和光掩模的共同优化
- 作者：Ashesh Parikh;Siew Dorris;Tom Smelko;Walter Walbrick;Pushpa Mahalingam;John Arch;Kent Green;Vishal Garg;Peter Buck;Craig West
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
66.Efficient approach to early detection of lithographic hotspots using machine learning systems and pattern matching

机译：利用机器学习系统和模式匹配早期检测光刻热点的有效方法
- 作者：Jen-Yi Wuu;Fedor G. Pikus;Malgorzata Marek-Sadowska
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- DFM;
- manufacturabilitly;
- lithography;
- lithographic hotspot;
- hotspot detection;
- pattern matching;
- machine learning;
- layout optimization;
67.Multi-selection method for physical design verification applications

机译：用于物理设计验证应用的多选择方法
- 作者：Salma Mostafa;J. Andres Torres;Peter Rezk;Kareem Madkour
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- DFM;
- Lithography checks;
- layout verification;
- layout portability;
- layout compatibility;
68.Validation of process cost effective layout refinement utilizing design intent

机译：利用设计意图验证工艺经济高效的布局精制
- 作者：Sachiko Kobayashi;Atsuhiko Ikeuchi;Kazunari Kimura;Toshiya Kotani;Satoshi Tanaka;Suigen Kyoh;Shimon Maeda;Soichi Inoue
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- OPC;
- RET;
- DfM;
- design intent;
- yield;
- hotspot;
- verification;
69.Lithographic Variation Aware Design Centering for SRAM Yield Enhancement

机译：SRAM产量增强的光刻变异感知设计居中
- 作者：Kanak Agarwal
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- Retargeting;
- SRAM;
- yield;
- design centering;
- design aware RET;
- electrically driven retargeting;
70.Moore's Law in the Innovation Era

机译：摩尔在创新时代的法律
- 作者：Mark Bohr
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- Scaling;
- Process Innovation;
- Microprocessor Innovation;
- System-on-Chip;
- System-in-Package;
71.Aerial Image Retargeting (AIR): Achieving Litho-Friendly Desirs

机译：空中图像retargeting（Air）：实现岩石友好的失望
- 作者：Ayman Yehia Hamouda;James Word;Mohab Anis;Karim S. Karim
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- OPC;
- RET;
- LFD;
- DFM;
- Process window;
- Model-based retargeting;
- Aerial Image;
72.New Double Patterning Technology for Direct Contact consideringPatterning Margin and Electrical Performance

机译：直接联系的新双图案技术考虑备线和电气性能
- 作者：Soo-Han Choi;A-Young Je;Jae-Seok Yang;Chul-Hong Park;Sang-Hoon Lee;Young-Kwan Park
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
73.Is Manufacturability with Double Patterning a Burden on Designer?Analysis of Device and Circuit Aspects

机译：是设计师双重标签的可制造性吗？设备和电路方面的分析
- 作者：Rasit Onur Topaloglu
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- Manufacturability;
- Double Patterning;
- Circuit Aspects;
74.Accurately Predicting Copper Interconnect Topographies in Foundry Design for Manufacturability Flows

机译：准确预测铸造铸造铜互连地形，用于制造性流动
- 作者：Daniel Lu;Zhong Fan;Ki Duk Tak;Li-Fu Chang;Elain Zou;Jenny Jian;Josh Yang;Linda Zhuang;Kuang Han Chen;Philippe Hurat;Hua Ding
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
75.A state-of-the-art hotspot recognition system for full chip verificationwith lithographic simulation

机译：用于完全芯片验证的最先进的热点识别系统，可平衡仿真
- 作者：Mark C. Simmons;Jae-hyun Kang;Youngkeun Kim;Joung Il Park;Seung weon Paek;Kee-sup Kim
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- candidate hotspot;
- coldspot;
- hotspot;
- lithography;
- pattern matching;
- process window;
- semiconductor;
76.Self-Aligned Double Patterning (SADP) Friendly Detailed Routing

机译：自对齐双重图案（SADP）友好的详细路由
- 作者：Minoo Mirsaeedi;J. Andres Torres;Mohab Anis
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- DFM;
- Double patterning lithography;
- SADP;
- layout decomposition;
77.Integrated Model-Based Retargeting and Optical Proximity Correction

机译：基于模型的型号和光学邻近校正
- 作者：Kanak B. Agarwal;Shayak Banerjee
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- aModel-based retargeting;
- OPC;
- hotspot fixing;
- normalized image log slope;
78.Performance and manufacturability trade-offs of pattern minimization for sub-22nm technology nodes

机译：子22NM技术节点的模式最小化的性能和可制造性权衡
- 作者：Vyacheslav V. Rovner;Tejas Jhaveri;Daniel Morris;Andrzej Strojwas;Larry Pileggi
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- Regular Design Fabric;
- Circuit-Layout Co-Optimization;
- Layout Pattern;
- Pattern Fill;
- DFM;
- SMO;
79.The effective etch process proximity correction methodology for improvingon chip CD variation in 20 nm node DRAM gate

机译：20 nm节点DRAM门中改变型芯片CD变化的有效蚀刻过程邻近校正方法
- 作者：Jeong-Geun Park;Sang-Wook Kim;Seong-Bo Shim;Sung-Soo Suh;Hye-Keun Oh
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- process proximity correction;
- on chip CD variation;
- dynamic random access memory;
- gate;
- etch;
- long range density effect;
80.HotSpot Detection using Image Pattern Recognition based onHigher-order Local Auto-Correlation

机译：热点检测使用基于图像模式识别的基于上高订购的本地自动相关性
- 作者：Shimon Maeda;Tetsuaki Matsunawa;Ryuji Ogawa;Hirotaka Ichikawa;Kazuhiro Takahata;Masahiro Miyairi;Toshiya Kotani;Shigeki Nojima;Satoshi Tanaka;Kei Nakagawa;Tamaki Saito;Shoji Mimotogi;Soichi Inoue;Hirokazu Nosato;Hidenori Sakanashi;Takumi Kobayashi;Masahiro Murakawa;Tetsuya Higuchi;Eiichi Takahashi;Nobuyuki Otsu
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- DfM;
- hotspot;
- image pattern recognition;
81.Defect-aware Reticle Floorplanning for EUV Masks

机译：用于EUV面具的缺陷感知掩盖平面图
- 作者：Abde Ali Kagalwalla;Puneet Gupta;Duck-Hyung Hur;Chul-Hong Park
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- Defect-aware Reticle;
- Floorplanning;
- EUV Masks;
82.Applying Litho-Aware Timing Analysis to Hold Time FixingReduces Design Cycle Time and Power Dissipation

机译：应用岩度感知时序分析保持时间修复设计周期时间和功耗
- 作者：Keisuke Hirabayashi;Naohiro Kobayashi;Hidemichi Mizuno;Tomoo Onodera;Tsuyoshi Oguro;Philippe Hurat;Arindam Chatterjee;Koichi Seki
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- Applying Litho-Aware Timing;
- Power Dissipation;
- Hold Time;
83.Characterization of the Performance Variation for Regular Standard Cell with Process Nonidealities

机译：常规标准电池与过程非前熟的性能变化的表征
- 作者：Hongbo Zhang;Yuelin Du;Martin D. F. Wong;Kai-Yuan Chao
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- 1-D Patterning;
- Dense Line Printing;
- Standard Cell Characterization;
84.Double Patterning Compliant Logic Design

机译：双图案标准兼容逻辑设计
- 作者：Yuansheng Ma;Jason Sweis;Chris Bencher;Yunfei Deng;Huixiong Dai;Hidekazu Yoshida;Bimal Gisuthan;Jongwook Kye;Harry J. Levinson
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- Optical lithography;
- double patterning;
- LELE;
- SADP;
- design rule;
- cell-level design;
- placement;
- routing;
85.Partial Least Squares-Preconditioned Importance Sampling for Fast Circuit Yield Estimation

机译：部分最小二乘 - 预先处理的快速电路产量估计的重要性采样
- 作者：Yu Ben;Costas J. Spanos
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- Partial Least;
- Squares-Preconditioned Importance;
- Yield Estimation;
86.Single exposure contacts are dead. Long live single exposure contacts!

机译：单次曝光触点已经死了。长时间的单次曝光联系人！
- 作者：Henning Haffner;Martin Ostermayr;Hideki Kanai;Chan Sam Chang;Bradley Morgenfeld;Jujin An;Meng Luo;Haoren Zhuang
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- double patterning (DP);
- double exposure (DE);
- single exposure (SE);
- SRAM;
- OPC;
- mask optimization (MO);
87.Decomposition-Aware Standard Cell Design Flows toEnable Double-Patterning Technology

机译：分解感知的标准单元设计流动可打开的双图案化技术
- 作者：Lars Liebmann;David Pietromonaco;Matthew Graf
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- double-patterning technology (DPT);
- design rule checking (DRC);
- standard cell design;
- placement;
- routing;
88.Timing Variability Analysis for Layout-Dependent-Effects in 28 nm Custom and Standard Cell-Based Designs

机译：28 nM定制和标准小区设计中布局依赖性效应的定时变化分析
- 作者：Philippe Hurat;Rasit O. Topaloglu;Ramez Nachman;Piyush Pathak;Jac CondeHa;Sriram Madhavan;Luigi Capodieci
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- Timing Variability;
- Cell-Based Designs;
- Layout-Dependent-Effects;
89.Methodology for balancing design and process tradeoffs for deep-subwavelength technologies

机译：平衡设计和流程折衷的方法论为深度亚波长技术
- 作者：Ioana Graur;Tina Wagner;Deborah Ryan;Dureseti Chidambarrao;Anand Kumaraswamy;Jeanne Bickford;Mark Styduhar;Lee Wang
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- OPC;
- RET;
- DR;
- DFM;
- simulation;
- pattern recognition;
90.Layout Decomposition of Self-Aligned Double Patterning for 2D Random Logic Patterning

机译：用于2D随机逻辑图案的自对准双图案的布局分解
- 作者：Yongchan Ban;Alex Miloslavsky;Kevin Lucas;Soo-Han Choi;Chul-Hong Park;David Z. Pan
- 会议名称：《SPIE Conference on Design for Manufacturability Through Design-process Integration》 | 2011年
- Double patterning;
- SADP;
- decomposition;
- lithography;
- random logic patterning;
- sub-30nm;