首页>外文会议>Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International

Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International

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1.Using function models and process flow descriptions in electronicsmanufacturing

机译：在电子产品中使用功能模型和过程流描述制造业
- 作者：Mayer R.;Cecil J.;Phelps D.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
2.Sequential experiments to characterize processingequipment-maximizing information content while restraining costs

机译：顺序实验以表征加工设备信息量最大化，同时抑制成本
- 作者：Reece J.E.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
3.Benchmarking and QFD: accelerating the successful implementation ofno clean soldering

机译：基准测试和QFD：加速成功实施没有干净的焊接
- 作者：Gutierrez S.;Tulkoff C.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
4.Evaluation of lead-free eutectic Sn-Ag solder for automotiveelectronics packaging applications

机译：汽车用无铅共晶锡银焊料的评估电子包装应用
- 作者：Shangguan D.;Achari A.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
5.A process for fabricating high current circuits with highinterconnect density

机译：具有高电流的高电流电路的制造方法互连密度
- 作者：Law H.H.;Roy A.;Kossives D.;Wu T.C.;Bacon D.D.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
6.Performance analysis of automated interbay material handling andstorage systems for large wafer fab

机译：湾际自动物料搬运和运输的性能分析大型晶圆厂的存储系统
- 作者：Carderelli G.;Pelagagge P.M.;Granito A.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
7.BGA inspection (Abstract)

机译：BGA检查（摘要）
- 作者：Rideout E.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
8.Development of outer lead bonding apparatus with a focused YAGlaser beam for high quality TCP bonding

机译：开发具有聚焦YAG的外部引线键合设备激光束，用于高质量的TCP粘接
- 作者：Uchiyama Y.;Myoi Y.;Tobuse H.;Sakamoto M.;Nishida Y.;Iwasa T.;Murakami E.;Yoshida M.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
9.Component standardization in a distributed workstation CADenvironment

机译：分布式工作站CAD中的组件标准化环境
- 作者：Peterson P.;Placente J.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
10.A fuzzy inferential approach for the diagnosis of defects inelectronics assembly

机译：一种模糊推理的缺陷诊断方法电子组装
- 作者：Cecil J.;Erraguntla M.;Mayer R.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
11.X-ray inspection of solder joints by planar computer tomography(PCT)

机译：平面计算机断层摄影术对焊点进行X射线检查（PCT）
- 作者：Neubauer C.;Schropfer S.;Hanke R.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
12.New solderless connection technology using light-setting insulationresin

机译：采用光绝缘材料的新型无焊连接技术树脂
- 作者：Nagao K.;Nishihara K.;Fujimoto H.;Hatada K.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
13.Gnosis - knowledge systemization: configuration systems for designand manufacturing

机译：Gnosis-知识系统化：设计配置系统和制造
- 作者：Murtagh N.;Toyama M.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
14.Practical application of laser inner lead bonding to TAB devicesover 500 pin counts

机译：激光内引线在TAB器件上的实际应用超过500针数
- 作者：Kimura Y.;Okamura M.;Yamada S.;Shimamoto H.;Yoshida M.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
15.JTEC panel report on electronic manufacturing and packaging inJapan

机译：JTEC小组报告中的电子制造和包装日本
- 作者：Pecht M.;Kelly M.;Boulton W.;Kukowski J.;Meieran G.;Peeples J.;Tummala R.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
16.Design and procurement of eutectic Sn/Pb solder-bumped flip chiptest die and organic substrates

机译：共晶Sn / Pb凸焊倒装芯片的设计与采购测试模具和有机基材
- 作者：Lau J.;Heydinger M.;Glazer J.;Uno D.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
17.Cellular and reentrant layouts for semiconductor wafer fabricationfacilities

机译：用于半导体晶圆制造的蜂窝状和凹入式布局设备
- 作者：Hase R.;Takoudis C.G.;Uzsoy R.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
18.Optimization of technological choices in SMT with respect tothermomechanical stresses

机译：SMT方面的技术选择优化热机械应力
- 作者：Fenech A.;Plano B.;Lavigne N.;Nicolas G.;Navarro D.;Hijazi A.;Danto Y.;Salagoity M.;Materne A.;Castillan P.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
19.The improvement of PBGA solder ball strength under high temperaturestorage

机译：高温下PBGA焊球强度的提高存储
- 作者：Miyazaki T.;Terashima K.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
20.Application of run by run controller to the chemical-mechanicalplanarization process. II

机译：逐次运行控制器在化学机械中的应用平面化过程。 II
- 作者：Hu A.;He Du;Wong S.;Renteln P.;Sachs E.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
21.Fluxless flip chip assembly on rigid and flexible polymersubstrates using the Au-Sn metallurgy

机译：刚性和柔性聚合物的无助焊剂倒装芯片组件使用金锡冶金的基材
- 作者：Zakel E.;Gwiasda J.;Kloeser J.;Eldring J.;Engelmann G.;Reichl H.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
22.Characterization and evaluation of the underfill encapsulants forflip chip assembly

机译：底部填充胶的特性和评估倒装芯片组装
- 作者：Wun B.;Lau J.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
23.Low temperature plasma deposition of silicon nitride to produceultra-reliable, high performance, low cost Sealed Chip-on-Board (SCOB)assemblies

机译：低温等离子体沉积氮化硅以产生超可靠，高性能，低成本密封板载芯片（SCOB）组件
- 作者：Kubacki R.M.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
24.Rapid prototyping of application-specific signal processors (RASSP)through the use of concurrent engineering CAD tools and frameworks

机译：专用信号处理器（RASSP）的快速原型制作通过使用并行工程CAD工具和框架
- 作者：Welsh J.J.;Saultz J.E.;Richards M.A.;Reitmeyer R.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
25.Far East manufacturing cost reduction by adjacent countryproduction

机译：远东制造成本按邻国降低生产
- 作者：Tilley K.J.;Conway P.P.;Williams D.J.;De Souza R.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
26.An approach for optimizing WIP/cycle time/output in a semiconductorfabricator

机译：一种优化半导体中在制品/周期时间/输出的方法制造者
- 作者：Leonovich G.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
27.Extending object oriented control models for intelligentmanufacturing systems

机译：扩展面向对象的控制模型以实现智能制造系统
- 作者：Hirschfeld R.A.;Keys L.K.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
28.Feasibility study of a robot hand-eye coordination based on fuzzylogic

机译：基于模糊的机器人手眼协调的可行性研究逻辑
- 作者：Kumaresan S.S.;Li H.H.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
29.Solder joint fatigue: comparison of hand soldering to vapor phasesoldering on surface mounted components for aerospace applications

机译：焊点疲劳：手工焊接与气相比较焊接在航空航天应用的表面安装组件上
- 作者：Bevan M.G.;Charles H.K. Jr.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
30.3-D packaging-applications of vertical multichip modules (MCM-V)for microsystems

机译：3-D封装-垂直多芯片模块（MCM-V）的应用用于微系统
- 作者：Val C.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
31.ATT lead-free solder paste for the cost effective manufactureof flip-chip silicon-on-silicon MCM

机译：AT＆T无铅焊锡膏，经济高效地制造芯片倒装硅MCM的设计
- 作者：Degani Y.;Dudderar T.D.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
32.The development of an automated rework cell for printed wiringassemblies

机译：开发用于印刷线路的自动化返修单元组件
- 作者：Merrick M.H.;Ruff L.R.;Millard D.L.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
33.Advanced low-cost bare-die packaging technology for liquid crystaldisplays

机译：先进的低成本液晶裸片封装技术显示
- 作者：Hwang J.C.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
34.Analysis the slider resonate characteristic in liquid-phase epitaxymanufacturing process

机译：分析液相外延中的滑块共振特性制造过程
- 作者：Fang-Lin Chaoi;Yu-Lin Chao
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
35.Design and fabrication of 600 DPI light-emitting diode printheadsusing precision flip-chip solder bump technology

机译：600 DPI发光二极管打印头的设计与制造使用精密的倒装芯片焊料凸点技术
- 作者：Imler W.R.;Hildebrandt T.;Paolini S.;Scholz K.D.;Cobarruviaz M.;Nagesh V.K.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
36.Intelligent enhancements for conventional layout systems to supportthe design of printed circuit boards

机译：常规布局系统的智能增强功能以支持印刷电路板设计
- 作者：Feldmann K.;Koch M.;Rothhaupt A.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》
37.Considerations for use of high pin count, multilayer PBGAs inengineering workstations

机译：使用高引脚数多层PBGA的注意事项工程工作站
- 作者：Towne D.;Kaul S.;Verstegen B.;Selna E.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1994. 'Low-Cost Manufacturing Technologies for Tomorrow's Global Economy'. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International》