Influence of the setting conditions on the property profile of adhesive-bonded joints between adherends with different coefficients of expansion

摘要

The bonding of materials with very different properties is frequently only possible by adhesive bonding. Hot setting adhesive systems are often used for this purpose. However, the heat curing process can lead to immediate damage to the adhesive layer because of relative movement of the adherends resulting from thermal expansion of these joining members. In this connection, the thermal expansion coefficients of the joining members and the way in which the components are secured during the hardening process play an important part. This needs to be considered both in designing the joint and in its preparation.