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Concentration effect of copper loading on the reductive dechlorination of tetrachloroethylene by zerovalent silicon

机译:铜含量对零价硅对四氯乙烯还原脱氯的影响

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The dechlorination of tetrachloroethylene (PCE) by zerovalent silicon (Si(0)) in the presence of lownconcentration of Cu(II) ion was investigated under anaerobic conditions. The mass loadings ofnCu(II) in the Si(0)-H2O system were in the range 0.06–3 wt% (0.02–1 mM). In addition, the X-raynphotoelectron spectroscopy (XPS) and electron probe microanalysis (EPMA) were used toncharacterize the change in chemical species and distribution patterns of metals, respectively.nResults showed that the pre-incubation time of 3 d was needed to activate the reactive sites ofnSi(0) before the dechlorination of PCE. Addition of low concentration of Cu(II) at 0.06wt%nsignificantly enhanced the dechlorination of PCE, while high concentration of Cu(II) would occupynthe reactive sites of Si(0), and subsequently decreased the dechlorination efficiency and rate ofnPCE. The pseudo first-order rate constant (kobs) for PCE dechlorination by 0.06wt% Cu/Si wasn0.028 h21, which was 2.8 times higher than that by Si(0) alone. However, the kobs for PCEndechlorination decreased to 0.0016 h21 when the loading of Cu(II) increased to 3 wt%. The EPMAnresults showed that the distribution of 0.06wt% Cu on the Si(0) surface was homogeneousnwithout any aggregation, which means that the maximum rate constant was observed before thentotal coverage of the active sites on the reductive metal by the catalytic metal layer. The surfacencoverage of Cu to Si(0) can theoretically calculate by estimation of the lowest energy fcc(111)ncrystallographic orientation. The calculated surface coverage of 0.06wt% Cu onto Si(0) wasnapproximately 43%, which is consistent with the experimental results obtained in this study.
机译:在厌氧条件下研究了在低浓度的Cu(II)离子存在下零价硅(Si(0))对四氯乙烯(PCE)的脱氯作用。 Si(0)-H2O系统中nCu(II)的质量负载范围为0.06–3 wt%(0.02–1 mM)。此外,X射线光电子能谱(XPS)和电子探针微分析(EPMA)分别表征了金属的化学种类和分布模式。n结果表明,预孵育需要3 d的时间才能激活金属。 PCE脱氯前nSi(0)的反应位点。添加0.06wt%的低浓度Cu(II)显着增强了PCE的脱氯作用,而高浓度的Cu(II)将占据Si(0)的反应位点,从而降低了nPCE的脱氯效率和速率。 0.06wt%Cu / Si对PCE脱氯的拟一级反应常数(kobs)为0.028 h21,比单独使用Si(0)时高2.8倍。但是,当Cu(II)的负载量增加到3 wt%时,用于PCEndechlorination的穗轴减少到0.0016 h21。 EPMA结果表明,0.06wt%的Cu在Si(0)表面的分布是均匀的,没有任何聚集,这意味着在催化金属层完全覆盖了还原金属上的活性位点之前,观察到了最大速率常数。理论上,可以通过估计最低能量fcc(111)n晶体学方向来计算Cu对Si(0)的表面覆盖率。计算得出的在Si(0)上0.06wt%的Cu的表面覆盖率约为43%,这与本研究中获得的实验结果是一致的。

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